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MMDF1N05E PDF预览

MMDF1N05E

更新时间: 2024-10-02 03:35:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 76K
描述
Power MOSFET 1 Amp, 50 Volts N-Channel SO-8, Dual

MMDF1N05E 数据手册

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MMDF1N05E  
Power MOSFET  
1 Amp, 50 Volts  
N−Channel SO−8, Dual  
These miniature surface mount MOSFETs feature ultra low R  
DS(on)  
http://onsemi.com  
and true logic level performance. They are capable of withstanding  
high energy in the avalanche and commutation modes and the  
drain−to−source diode has a low reverse recovery time. MiniMOSt  
devices are designed for use in low voltage, high speed switching  
applications where power efficiency is important. Typical applications  
are dc−dc converters, and power management in portable and battery  
powered products such as computers, printers, cellular and cordless  
phones. They can also be used for low voltage motor controls in mass  
storage products such as disk drives and tape drives. The avalanche  
energy is specified to eliminate the guesswork in designs where  
inductive loads are switched and offer additional safety margin against  
unexpected voltage transients.  
1 AMPERE, 50 VOLTS  
RDS(on) = 300 mW  
N−Channel  
D
G
S
Features  
MARKING  
DIAGRAM  
Ultra Low R  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
Logic Level Gate Drive − Can Be Driven by Logic ICs  
Miniature SO−8 Surface Mount Package − Saves Board Space  
Diode Is Characterized for Use In Bridge Circuits  
Diode Exhibits High Speed  
8
1
SO−8  
CASE 751  
STYLE 11  
F1N05  
AYWWG  
G
8
Avalanche Energy Specified  
1
Mounting Information for SO−8 Package Provided  
I  
Specified at Elevated Temperature  
DSS  
F1N05 = Device Code  
Pb−Free Package is Available  
A
Y
WW  
G
= Assembly Location  
= Year  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
= Work Week  
= Pb−Free Package  
Rating  
Symbol  
Value  
50  
Unit  
V
(Note: Microdot may be in either location)  
Drain−to−Source Voltage  
V
DS  
GS  
Gate−to−Source Voltage − Continuous  
V
20  
V
PIN ASSIGNMENT  
Drain Current − Continuous  
Drain Current − Pulsed  
I
2.0  
10  
A
D
Source−1  
Gate−1  
Drain−1  
Drain−1  
Drain−2  
1
2
3
4
8
7
6
5
I
DM  
Single Pulse Drain−to−Source Avalanche  
E
AS  
300  
mJ  
Energy − Starting T = 25°C  
Source−2  
J
(V = 25 V, V = 10 V, I = 2 Apk)  
DD  
GS  
L
Gate−2  
Drain−2  
Operating and Storage Temperature Range  
T , T  
−55 to 150  
2.0  
°C  
W
J
stg  
Top View  
Total Power Dissipation @ T = 25°C  
P
D
A
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
62.5  
°C/W  
q
JA  
ORDERING INFORMATION  
Device  
Package  
Shipping  
Maximum Temperature for Soldering,  
Time in Solder Bath  
T
260  
10  
°C  
Sec  
L
MMDF1N05ER2  
SO−8  
2,500/Tape & Reel  
2,500/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MMDF1N05ER2G  
SO−8  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. Mounted on 2square FR4 board (1sq. 2 oz. Cu 0.06thick single sided) with  
one die operating, 10 sec. max.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 8  
MMDF1N05E/D  
 

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