MMDF1N05E
Power MOSFET
1 Amp, 50 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low R
DS(on)
http://onsemi.com
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a low reverse recovery time. MiniMOSt
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc−dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
1 AMPERE, 50 VOLTS
RDS(on) = 300 mW
N−Channel
D
G
S
Features
MARKING
DIAGRAM
• Ultra Low R
Provides Higher Efficiency and Extends Battery Life
DS(on)
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed
8
1
SO−8
CASE 751
STYLE 11
F1N05
AYWWG
G
8
• Avalanche Energy Specified
1
• Mounting Information for SO−8 Package Provided
• I
Specified at Elevated Temperature
DSS
F1N05 = Device Code
• Pb−Free Package is Available
A
Y
WW
G
= Assembly Location
= Year
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
= Work Week
= Pb−Free Package
Rating
Symbol
Value
50
Unit
V
(Note: Microdot may be in either location)
Drain−to−Source Voltage
V
DS
GS
Gate−to−Source Voltage − Continuous
V
20
V
PIN ASSIGNMENT
Drain Current − Continuous
Drain Current − Pulsed
I
2.0
10
A
D
Source−1
Gate−1
Drain−1
Drain−1
Drain−2
1
2
3
4
8
7
6
5
I
DM
Single Pulse Drain−to−Source Avalanche
E
AS
300
mJ
Energy − Starting T = 25°C
Source−2
J
(V = 25 V, V = 10 V, I = 2 Apk)
DD
GS
L
Gate−2
Drain−2
Operating and Storage Temperature Range
T , T
−55 to 150
2.0
°C
W
J
stg
Top View
Total Power Dissipation @ T = 25°C
P
D
A
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
62.5
°C/W
q
JA
ORDERING INFORMATION
†
Device
Package
Shipping
Maximum Temperature for Soldering,
Time in Solder Bath
T
260
10
°C
Sec
L
MMDF1N05ER2
SO−8
2,500/Tape & Reel
2,500/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
MMDF1N05ER2G
SO−8
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
one die operating, 10 sec. max.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 8
MMDF1N05E/D