MBT3904DW1,
MBT3904DW2,
SMBT3904DW1,
NSVMBT3904DW1
Dual General Purpose
Transistors
www.onsemi.com
MARKING
DIAGRAM
The MBT3904DW1 and MBT3904DW2 devices are a spin−off of
our popular SOT−23/SOT−323 three−leaded device. It is designed for
general purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
6
SOT−363/SC−88/
SC70−6
CASE 419B
XX MG
6
G
1
1
Features
XX=MA for MBT3904DW1T1G
MJ for MBT3904DW2T1G
M =Date Code
• h , 100−300
FE
• Low V
, ≤ 0.4 V
CE(sat)
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
(3)
(2)
(1)
Q
• Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
• S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
Q
1
2
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
(4)
(5)
(6)
MBT3904DW1T1
STYLE 1
MAXIMUM RATINGS
(3)
(2)
(1)
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
40
Unit
Vdc
V
CEO
V
CBO
V
EBO
Q
2
60
Vdc
Q
1
6.0
Vdc
Collector Current − Continuous
Electrostatic Discharge
I
200
mAdc
C
(4)
(5)
(6)
ESD
HBM Class 2
MM Class B
MBT3904DW2T1
STYLE 27
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Device
Shipping
Package
THERMAL CHARACTERISTICS
MBT3904DW1T1G,
MBT3904DW2T1G
3000 /
SOT−363
(Pb−Free)
Characteristic
Symbol
Max
Unit
Tape & Reel
3000 /
Total Package Dissipation (Note 1)
T = 25°C
A
P
D
150
mW
SMBT3904DW1T1G
SOT−363
(Pb−Free) Tape & Reel
Thermal Resistance,
Junction−to−Ambient
R
833
°C/W
°C
q
JA
NSVMBT3904DW1T3G
10000 /
Tape & Reel
SOT−363
(Pb−Free)
Junction and Storage
Temperature Range
T , T
−55 to +150
J
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
June, 2015 − Rev. 11
MBT3904DW1T1/D