Datasheet > KMB32M

KMB32M

更新时间： 2024-11-13 01:17:55

品牌	Logo	应用领域
迪一电子 - DYELEC		/
页数	文件大小	规格书
2页	1145K
描述
Schottky Brrier Chip

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中文翻译

获取价格

数据手册

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KMB32M 数据手册

KMB32M THRU KMB325M

3.0

SCHOTTKY

SINGLE PHASE

AMP SURFACE MOUNT

BRIDGE RECTIFIER

Features

MBM

Schottky Brrier Chip

0.157（4.0）

0.134（3.4）

Low Power Loss,High Efficiency

Ideally Suited for Automatic Assembly

Surge Overload Rating to 80A Peak

Plastic Case Material has UL Flammability

0.012（0.30）

0.004（0.10）

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Rating

0.028（0.7）

0.4

（

）

0.236 6.0

0.016（

）

（

0.213 5.4

）

Mechanical Data

0.051（1.3）

0.035（0.9）

0.106（2.7）

0.091（2.3）

· Case: MB-S, molded plastic

· Terminals: plated leads solderable per

MIL-STD-202, Method 208

0.203（5.15）

0.179（4.55）

· Polarity: as marked on case

· Mounting position: Any

0.106（2.7）

0.091（2.3）

· Marking: type number

0.193（4.90）

0.177（4.50）

· Lead Free: For RoHS / Lead Free Version,

Dimiensions in inches and（milimeters）

Maximum Ratings and Electrical Characteristics ^@T_A^{=25°C unless otherwise specified}

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

KMB KMB

315M320M 325M

310M

KMB

38M

KMB KMB

35M 36M

KMB KMB KMB KMB

32M 33M 34M345M

SYMBOL

UNITS

TYPE NUMBER

50 60 80

20 30

100 150 200 250

105 140 175

100 150 200 250

40 45

28 31

40 45

Peak Repetitive Reverse Voltage

RMS Reverse Voltage

DC Blocking Voltage

V^RRM

V^R(RMS)

35 42

V^DC

Average Rectified Output Current ( Note1) @T = 90°C

I^O

3.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

FSM

I²t Rating for Fusing (t < 8.3ms)

²t

5.0

0.7

0.55

0.90

0.92

Forward Voltage per element

@I_F=3.0A

0.85

VFM

0.05

0.1

Peak Reverse Current

At Rated DC Blocking Voltage

@T_A= 25°C

@T_A= 100°C

I_RM

Typical Junction Capacitance per leg

Typical Thermal Resistance per leg

°C/W

( Note2)

R^ꢀ^JA

Operating junction temperature range

°C

-55 to +150

Operating and Storage Temperature Range

T_STG

Note:

1. Mounted on aluminum substrate PC board with 1.3mm solder pad.

2. Thermal REsistance From Junction to Ambient

version:01

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