HiPerFASTTM IGBT
with Diode
VCES
= 600 V
IXGH 30N60BD1
IXGT 30N60BD1
IC25
VCE(sat)
=
=
60 A
1.8 V
tfi(typ)
= 100 ns
Symbol
TestConditions
MaximumRatings
TO-268
(IXGT)
VCES
VCGR
TJ = 25°C to 150°C
600
600
V
V
G
E
TJ = 25°C to 150°C; RGE = 1 MW
VGES
VGEM
Continuous
Transient
±20
±30
V
V
C (TAB)
IC25
IC90
ICM
TC = 25°C
60
30
A
A
A
TO-247 AD
(IXGH)
TC = 90°C
TC = 25°C, 1 ms
120
G
C
E
SSOA
(RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 10 W
Clamped inductive load, L = 100 mH
ICM = 60
@ 0.8 VCES
A
C (TAB)
PC
TC = 25°C
200
W
G = Gate,
C = Collector,
E = Emitter,
TAB = Collector
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
Features
-55 ... +150
• Internationalstandardpackage
• ModeratefrequencyIGBTand
antiparallelFREDinonepackage
• Highcurrenthandlingcapability
• NewestgenerationHDMOSTM
process
MaximumLeadandTabtemperatureforsoldering
1.6 mm (0.062 in.) from case for 10 s
300
°C
Md
Mountingtorque, TO-247AD
1.13/10
Nm/lb.in.
Weight
TO-247 AD
TO-268
6
4
g
g
• MOS Gate turn-on
- drive simplicity
Applications
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptiblepowersupplies(UPS)
• Switch-modeandresonant-mode
powersupplies
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
BVCES
VGE(th)
IC = 250mA, VGE = 0 V
IC = 250 mA, VCE = VGE
600
2.5
V
5.0
V
Advantages
ICES
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
TJ = 150°C
200
3
mA
mA
• Space savings (two devices in one
package)
• High power density
• Optimized Vce(sat) and switching
speedsformediumfrequency
application
IGES
VCE = 0 V, VGE = ±20 V
±100
nA
V
VCE(sat)
IC = IC90, VGE = 15 V
1.8
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
98510C(7/00)
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