Datasheet > IS61C64AL

IS61C64AL

更新时间： 2024-10-28 04:44:47

品牌	Logo	应用领域
美国芯成 - ISSI		/
页数	文件大小	规格书
13页	96K
描述
8K x 8 HIGH-SPEED CMOS STATIC RAM

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中文翻译

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数据手册

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IS61C64AL 数据手册

PACKAGING INFORMATION

300-mil Plastic SOJ

Package Code: J

ISSI

SEATING PLANE

Notes:

1. Controlling dimension: inches, unless otherwise

specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash

protrusionsandshouldbemeasuredfromthebottomof

MILLIMETERS

INCHES

Min. Typ. Max.

Sym. Min. Typ. Max.

N0.

thepackage

4. Formed leads shall be planar with respect to one

another within 0.004 inches at the seating plane.

Leads

24/26

—

3.56

—

0.140

—

0.64

2.41

0.41

0.66

0.20

17.02

8.26

7.49

6.27

0.025

0.095

0.016

0.026

0.008

0.670

0.325

0.295

0.247

2.67

0.51

0.81

0.25

17.27

8.76

7.75

7.29

0.105

0.020

0.032

0.010

0.680

0.345

0.305

0.287

1.27 BSC

0.050 BSC

without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774

Rev. D

02/25/03

1...8 9 101112 13

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