Datasheet > IS61C64AL

IS61C64AL

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
美国芯成 - ISSI		/
页数	文件大小	规格书
13页	96K
描述
8K x 8 HIGH-SPEED CMOS STATIC RAM

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数据手册

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IS61C64AL 数据手册

PACKAGINGINFORMATION

ISSI

Plastic TSOP - 28-pins

Package Code: T (Type I)

SEATING PLANE

Plastic TSOP (T—Type I)

Millimeters

Inches

Symbol

Min

Max

Min

Max

Ref. Std.

No. Leads

Notes:

1. Controlling dimension: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and

1.00

0.05

0.16

0.10

7.90

11.70

13.20

0.55 BSC

1.20

0.20

0.27

0.20

8.10

0.037

0.002

0.006

0.004

0.308

0.456

0.515

0.047

0.008

0.011

0.008

0.316

0.465

0.531

should be measured from the bottom of the package

4. Formed leads shall be planar with respect to one another within

0.004 inches at the seating plane.

11.90

13.60

0.022 BSC

0.30

0.70

0.011

0.027

0°

5°

0°

5°

Integrated Silicon Solution, Inc.

PK13197T28 Rev. B 01/31/97

1...10 11 1213

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