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IS61C64AL-10TI PDF预览

IS61C64AL-10TI

更新时间: 2024-10-28 04:44:47
品牌 Logo 应用领域
美国芯成 - ISSI 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
13页 96K
描述
8K x 8 HIGH-SPEED CMOS STATIC RAM

IS61C64AL-10TI 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:PLASTIC, TSOP1-28针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.64
Is Samacsys:N最长访问时间:10 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G28
JESD-609代码:e0长度:11.8 mm
内存密度:65536 bit内存集成电路类型:STANDARD SRAM
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:28
字数:8192 words字数代码:8000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP28,.53,22
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.0001 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.05 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

IS61C64AL-10TI 数据手册

 浏览型号IS61C64AL-10TI的Datasheet PDF文件第2页浏览型号IS61C64AL-10TI的Datasheet PDF文件第3页浏览型号IS61C64AL-10TI的Datasheet PDF文件第4页浏览型号IS61C64AL-10TI的Datasheet PDF文件第5页浏览型号IS61C64AL-10TI的Datasheet PDF文件第6页浏览型号IS61C64AL-10TI的Datasheet PDF文件第7页 
®
IS61C64AL  
ISSI  
MARCH2006  
8K x 8 HIGH-SPEED CMOS STATIC RAM  
FEATURES  
DESCRIPTION  
The ISSI IS61C64AL is a very high-speed, low power,  
8192-word by 8-bit static RAM. It is fabricated using ISSI's  
high-performance CMOS technology. This highly reliable  
processcoupledwithinnovativecircuitdesigntechniques,  
yields access times as fast as 10 ns with low power  
consumption.  
• High-speed access time: 10 ns  
• CMOS low power operation  
— 1 mW (typical) CMOS standby  
— 125 mW (typical) operating  
• TTL compatible interface levels  
• Single 5V power supply  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down to 150 µW (typical) with CMOS input levels.  
• Fully static operation: no clock or refresh  
required  
• Lead-free available  
Easy memory expansion is provided by using one Chip  
Enable input, CE. The active LOW Write Enable (WE)  
controls both writing and reading of the memory.  
The IS61C64AL is packaged in the JEDEC standard 28-  
pin, 300-mil SOJ, and TSOP.  
FUNCTIONAL BLOCK DIAGRAM  
8K x 8  
MEMORY ARRAY  
A0-A12  
DECODER  
VDD  
GND  
I/O  
DATA  
COLUMN I/O  
I/O0-I/O7  
CIRCUIT  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability  
arisingoutoftheapplicationoruseofanyinformation, productsorservicesdescribedherein. Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonany  
publishedinformationandbeforeplacingordersforproducts.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
1
Rev. A  
03/16/06  

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