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IRG4CC88KBPBF PDF预览

IRG4CC88KBPBF

更新时间: 2024-11-02 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 电动机控制晶体管
页数 文件大小 规格书
1页 121K
描述
Insulated Gate Bipolar Transistor, 600V V(BR)CES, N-Channel, 6 INCH, WAFER

IRG4CC88KBPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:UNCASED CHIP, O-XUUC-NReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.66
其他特性:ULTRA FAST SPEED集电极-发射极最大电压:600 V
配置:SINGLEJESD-30 代码:O-XUUC-N
元件数量:1封装主体材料:UNSPECIFIED
封装形状:ROUND封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:MOTOR CONTROL
晶体管元件材料:SILICONBase Number Matches:1

IRG4CC88KBPBF 数据手册

  
PD-91869  
IRG4CC88KB  
IRG4CC88KB IGBT Die in Wafer Form  
C
600 V  
Size 8.8  
Ultra-Fast Speed  
Short Circuit Rated  
6" Wafer  
G
E
Electrical Characteristics ( Wafer Form )  
Parameter  
VCE (on)  
V(BR)CES  
VGE(th)  
ICES  
Description  
Guaranteed (Min/Max)  
Test Conditions  
IC = 10A, TJ = 25°C, VGE = 15V  
TJ = 25°C, ICES = 250µA, VGE = 0V  
VGE = VCE , TJ =25°C, IC = 1.0mA  
TJ = 25°C, VCE = 600V  
Collector-to-Emitter Saturation Voltage  
Colletor-to-Emitter Breakdown Voltage  
Gate Threshold Voltage  
4.5V Max.  
600V Min.  
3.0V Min., 6.5V Max.  
200 µA Max.  
Zero Gate Voltage Collector Current  
Gate-to-Emitter Leakage Current  
IGES  
± 11 µA Max.  
TJ = 25°C, VGE = +/- 20V  
Mechanical Data  
Nominal Backmetal Composition, Thickness:  
Nominal Front Metal Composition, Thickness:  
Dimensions:  
Cr-NiV-Ag ( 1kA°-2kA°-2.5kA° )  
99% Al, 1% Si (4 microns)  
.5705" x .5705"  
Wafer Diameter:  
150mm, with std. < 100 > flat  
.015" + / -.003"  
Wafer thickness:  
Relevant Die Mechanical Dwg. Number  
Minimum Street Width  
01-5347  
100 Microns  
Reject Ink Dot Size  
0.25mm Diameter Minimum  
Consistent throughout same wafer lot  
Store in original container, in dessicated  
nitrogen, with no contamination  
For optimum electrical results, die attach  
temperature should not exceed 300C  
Ink Dot Location  
Recommended Storage Environment:  
Recommended Die Attach Conditions  
Reference Standard IR packaged part ( for design ) : N/A  
Die Outline  
3/25/99  

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