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IRFZ48ZSTRL PDF预览

IRFZ48ZSTRL

更新时间: 2024-11-05 20:02:27
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
13页 283K
描述
Power Field-Effect Transistor, 61A I(D), 55V, 0.011ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, D2PAK-3

IRFZ48ZSTRL 技术参数

是否Rohs认证: 不符合生命周期:End Of Life
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.03
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE雪崩能效等级(Eas):73 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (ID):61 A
最大漏源导通电阻:0.011 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):225极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):240 A认证状态:Not Qualified
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFZ48ZSTRL 数据手册

 浏览型号IRFZ48ZSTRL的Datasheet PDF文件第2页浏览型号IRFZ48ZSTRL的Datasheet PDF文件第3页浏览型号IRFZ48ZSTRL的Datasheet PDF文件第4页浏览型号IRFZ48ZSTRL的Datasheet PDF文件第5页浏览型号IRFZ48ZSTRL的Datasheet PDF文件第6页浏览型号IRFZ48ZSTRL的Datasheet PDF文件第7页 
PD - 95574  
IRFZ48ZPbF  
AUTOMOTIVE MOSFET  
IRFZ48ZSPbF  
Features  
IRFZ48ZLPbF  
O
O
O
O
O
O
O
Advanced Process Technology  
HEXFET® Power MOSFET  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
D
VDSS = 55V  
RDS(on) = 11mΩ  
G
Description  
ID = 61A  
Specifically designed for Automotive applica-  
tions,thisHEXFET® PowerMOSFETutilizesthe  
latestprocessingtechniquestoachieveextremely  
low on-resistance per silicon area. Additional  
features of this design are a 175°C junction  
operatingtemperature, fastswitchingspeedand  
improved repetitive avalanche rating . These  
features combine to make this design an ex-  
tremely efficient and reliable device for use in  
Automotive applications and a wide variety of  
S
D2Pak  
IRFZ48ZS  
TO-262  
IRFZ48ZL  
TO-220AB  
IRFZ48Z  
other applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
61  
Units  
I
I
I
@ TC = 25°C  
@ TC = 100°C  
A
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (See Fig. 9)  
Pulsed Drain Current  
D
D
43  
240  
91  
DM  
P
@TC = 25°C  
W
Maximum Power Dissipation  
D
Linear Derating Factor  
0.61  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS  
73  
120  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested)  
IAR  
See Fig.12a,12b,15,16  
A
EAR  
mJ  
°C  
Repetitive Avalanche Energy  
T
J
-55 to + 175  
Operating Junction and  
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.64  
–––  
62  
Units  
Rθ  
°C/W  
JC  
CS  
JA  
JA  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
0.50  
–––  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
107/19/04  

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