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IRFR4104TRR PDF预览

IRFR4104TRR

更新时间: 2024-01-14 10:44:09
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
12页 5033K
描述
AUTOMOTIVE GRADE

IRFR4104TRR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-252AA
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.1其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):145 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):42 A最大漏极电流 (ID):42 A
最大漏源导通电阻:0.0055 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):140 W
最大脉冲漏极电流 (IDM):480 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN OVER NICKEL端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR4104TRR 数据手册

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AUIRFR4104  
AUTOMOTIVE GRADE  
AUIRFU4104  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
D
S
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
V(BR)DSS  
40V  
5.5m  
RDS(on) max.  
ID (Silicon Limited)  
ID (Package Limited)  
G
119A  
42A  
Description  
D
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon area. Additional features of this design are a  
175°C junction operating temperature, fast switching  
speed and improved repetitive avalanche rating . These  
features combine to make this design an extremely  
efficient and reliable device for use in Automotive appli-  
cations and a wide variety of other applications.  
S
S
D
G
G
D-Pak  
AUIRFR4104  
I-Pak  
AUIRFU4104  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
119  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
Units  
I
I
I
I
@ T = 25°C  
C
D
D
D
84  
A
@ T = 100°C  
C
42  
@ T = 25°C  
C
480  
DM  
140  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.95  
Linear Derating Factor  
± 20  
V
Gate-to-Source Voltage  
GS  
EAS  
145  
310  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
mJ  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.05  
40  
Units  
Rθ  
JC  
Rθ  
JA  
Rθ  
JA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
www.kersemi.com  
1

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