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IRFR4105 PDF预览

IRFR4105

更新时间: 2024-11-23 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 146K
描述
Power MOSFET(Vdss=55V, Rds(on)=0.045ohm, Id=27A)

IRFR4105 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
风险等级:5.65其他特性:AVALANCHE RATED, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):65 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (ID):20 A最大漏源导通电阻:0.045 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):100 A表面贴装:YES
端子面层:NOT SPECIFIED端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR4105 数据手册

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PD - 91302C  
IRFR/U4105  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Surface Mount (IRFR4105)  
l Straight Lead (IRFU4105)  
l Fast Switching  
D
VDSS = 55V  
RDS(on) = 0.045Ω  
l Fully Avalanche Rated  
G
Description  
ID = 27A  
S
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide  
variety of applications.  
The D-PAK is designed for surface mounting using  
vapor phase, infrared, or wave soldering techniques.  
The straight lead version (IRFU series) is for through-  
hole mounting applications. Power dissipation levels  
up to 1.5 watts are possible in typical surface mount  
applications.  
D-PAK  
T O -252AA  
I-PAK  
TO -251AA  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current ‡  
27ꢀ  
19  
A
100  
68  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.45  
± 20  
65  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚‡  
Avalanche Current‡  
mJ  
A
16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
6.8  
5.0  
mJ  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
2.2  
Units  
°C/W  
1
RθJC  
RθJA  
Junction-to-Ambient (PCB mount) **  
Junction-to-Ambient  
50  
RθJA  
110  
www.irf.com  
5/11/98  

IRFR4105 替代型号

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