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IRFR4105PBF PDF预览

IRFR4105PBF

更新时间: 2024-11-24 12:33:43
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
10页 3846K
描述
Ultra Low On-Resistance

IRFR4105PBF 数据手册

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PD - 95550A  
IRFR4105PbF  
IRFU4105PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Surface Mount (IRFR4105)  
l Straight Lead (IRFU4105)  
l Fast Switching  
D
VDSS = 55V  
l Fully Avalanche Rated  
l Lead-Free  
RDS(on) = 0.045Ω  
G
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide  
variety of applications.  
ID = 27A  
S
The D-PAK is designed for surface mounting using  
vapor phase, infrared, or wave soldering techniques.  
The straight lead version (IRFU series) is for through-  
hole mounting applications. Power dissipation levels  
up to 1.5 watts are possible in typical surface mount  
applications.  
D-PAK  
TO-252AA  
I-PAK  
TO-251AA  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current ‡  
27ꢀ  
19  
A
100  
68  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.45  
± 20  
65  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚‡  
Avalanche Current‡  
mJ  
A
16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
6.8  
5.0  
mJ  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
2.2  
Units  
°C/W  
1
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount) **  
Junction-to-Ambient  
50  
110  
www.kersemi.com  
1/7/05  

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