PD - 94611A
SMPS MOSFET
IRFP26N60L
HEXFET® Power MOSFET
Applications
• Zero Voltage Switching SMPS
Trr typ.
VDSS RDS(on) typ.
600V
ID
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control applications
170ns 26A
210m
Ω
Features and Benefits
• SuperFast body diode eliminates the need for external
diodes in ZVS applications.
• Lower Gate charge results in simpler drive requirements.
• Enhanced dv/dt capabilities offer improved ruggedness.
• Higher Gate voltage threshold offers improved noise immunity.
TO-247AC
Absolute Maximum Ratings
Parameter
Continuous Drain Current, VGS @ 10V
Max.
26
Units
A
I @ T = 25°C
D
C
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I @ T = 100°C
17
D
C
I
100
470
DM
P @T = 25°C
Power Dissipation
W
D
C
Linear Derating Factor
Gate-to-Source Voltage
3.8
±30
W/°C
V
V
GS
Peak Diode Recovery dv/dt
Operating Junction and
dv/dt
30
V/ns
T
-55 to + 150
J
T
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
1.1(10)
N•m (lbf•in)
Diode Characteristics
Symbol
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
––– ––– 26
MOSFET symbol
D
(Body Diode)
Pulsed Source Current
A
showing the
integral reverse
G
I
––– ––– 100
SM
S
(Body Diode)
p-n junction diode.
V
T = 25°C, I = 26A, V = 0V
J S GS
Diode Forward Voltage
Reverse Recovery Time
––– ––– 1.5
V
SD
t
rr
T = 25°C, I = 26A
J F
––– 170 250 ns
––– 210 320
TJ = 125°C, di/dt = 100A/µs
Q
T = 25°C, I = 26A, V = 0V
Reverse Recovery Charge
––– 670 1000 nC
––– 1050 1570
rr
J
S
GS
TJ = 125°C, di/dt = 100A/µs
IRRM
T = 25°C
Reverse Recovery Current
Forward Turn-On Time
––– 7.3
11
A
J
t
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
on
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1
10/19/04