PD - 95316
IRFL1006PbF
HEXFET® Power MOSFET
ꢀ Surface Mount
D
ꢀ Advanced Process Technology
ꢀ Dynamic dv/dt Rating
ꢀ Fast Switching
VDSS = 60V
RDS(on) = 0.22Ω
ꢀ Fully Avalanche Rated
ꢀ Lead-Free
G
ID = 1.6A
S
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremelylow on-resistancepersiliconarea. Thisbenefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
knownfor,providesthedesignerwithanextremelyefficient
andreliabledeviceforuseinawidevarietyofapplications.
The SOT-223 package is designed for surface-mount
usingvaporphase,infrared,orwavesolderingtechniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
SOT-223
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TA = 25°C
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V**
Continuous Drain Current, VGS @ 10V*
Continuous Drain Current, VGS @ 10V*
Pulsed Drain Current ꢁ
2.3
1.6
A
1.3
6.4
PD @TA = 25°C
PD @TA = 25°C
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
2.1
W
W
1.0
8.3
mW/°C
V
VGS
± 20
54
EAS
Single Pulse Avalanche Energyꢂ
Avalanche Currentꢁ
mJ
A
IAR
1.6
EAR
Repetitive Avalanche Energyꢁ*
Peak Diode Recovery dv/dt ꢃ
Junction and Storage Temperature Range
0.1
mJ
V/ns
°C
dv/dt
TJ, TSTG
5.0
-55 to + 150
Thermal Resistance
Parameter
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Typ.
90
Max.
120
60
Units
RθJA
RθJA
°C/W
50
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
1
05/26/04