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IRFL4105 PDF预览

IRFL4105

更新时间: 2024-11-15 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 170K
描述
Power MOSFET(Vdss=55V, Rds(on)=0.045ohm, Id=3.7A)

IRFL4105 数据手册

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PD- 91381A  
IRFL4105  
HEXFET® Power MOSFET  
l Surface Mount  
D
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l Fast Switching  
VDSS = 55V  
RDS(on) = 0.045Ω  
ID = 3.7A  
G
l Fully Avalanche Rated  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The SOT-223 package is designed for surface-mount  
using vapor phase, infra red, or wave soldering techniques.  
Its unique package design allows for easy automatic pick-  
and-place as with other SOT or SOIC packages but has the  
added advantage of improved thermal performance due to  
an enlarged tab for heatsinking. Power dissipation of 1.0W  
is possible in a typical surface mount application.  
SO T -223  
Absolute Maximum Ratings  
Parameter  
Max.  
5.2  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V**  
Continuous Drain Current, VGS @ 10V*  
Continuous Drain Current, VGS @ 10V*  
Pulsed Drain Current   
3.7  
A
3.0  
30  
PD @TA = 25°C  
PD @TA = 25°C  
Power Dissipation (PCB Mount)**  
Power Dissipation (PCB Mount)*  
Linear Derating Factor (PCB Mount)*  
Gate-to-Source Voltage  
2.1  
W
W
1.0  
8.3  
mW/°C  
V
VGS  
± 20  
110  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
IAR  
3.7  
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
0.10  
5.0  
mJ  
V/ns  
°C  
dv/dt  
TJ, TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
RθJA  
Junction-to-Amb. (PCB Mount, steady state)*  
90  
120  
°C/W  
Junction-to-Amb. (PCB Mount, steady state)**  
50  
60  
* When mounted on FR-4 board using minimum recommended footprint.  
** When mounted on 1 inch square copper board, for comparison with other SMD devices.  
www.irf.com  
1
1/14/99  

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