IRFL9014PBF

更新时间： 2024-11-16 04:23:23

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页数	文件大小	规格书
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描述
HEXFET㈢ Power MOSFET

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数据手册

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IRFL9014PBF 数据手册

PD - 95153

IRFL9014PbF

HEXFET^®Power MOSFET

l Surface Mount

l Available in Tape & Reel

l Dynamic dv/dt Rating

l Repetitive Avalanche Rated

V_DSS= -60V

P-Channel

_DS(on)= 0.50Ω

l Fast Switching

l Ease of Paralleling

l Lead-Free

I_D= -1.8A

Description

Third Generation HEXFETs from International Rectifier

provide the designer with the best combination of fast

switching, ruggedized device design, low on-resistance

andcost-effectiveness.

TheSOT-223packageisdesignedforsurface-mountusing

vapor phase, infra red, or wave soldering techniques. Its

uniquepackagedesignallowsforeasyautomaticpick-and-

place as with other SOT or SOIC packages but has the

addedadvantageofimprovedthermalperformancedueto

an enlarged tab for heatsinking. Power dissipation of

grreater than 1.25W is possible in a typical surface mount

application.

SOT-223

Absolute Maximum Ratings

Parameter

Max.

-1.8

-1.1

-14

Units

I_D@ Tc = 25°C

I_D@ Tc = 100°C

I_DM

Continuous Drain Current, V_GS@ -10 V

Pulsed Drain Current

P_D@Tc = 25°C

P_D@T_A= 25°C

Power Dissipation

3.1

Power Dissipation (PCB Mount)**

Linear Derating Factor

2.0

0.025

0.017

-/+20

140

Linear Derating Factor (PCB Mount)**

Gate-to-Source Voltage

W/°C

V_GS

E_AS

Single Pulse Avalanche Energy

Avalanche Current

I_AR

-1.8

0.31

-4.5

E_AR

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

Junction and Storage Temperature Range

Soldewring Temperature, for 10 seconds

V/ns

dv/dt

T_J,T_STG

-55 to + 150

300 (1.6mm from case)

°C

Thermal Resistance

Parameter

Junction-to-PCB

Junction-to-Ambient.(PCBMount)**

Typ.

–––

Max.

Units

R_θJC

R_θJA

°C/W

** When mounted on 1'' SQUARE pcb (FR-4 or G-10 Material).

For recommended footprint and soldering techniques refer to application note #AN-994.

www.irf.com

4/20/04

12 3 4 5 6 7 8

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