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IRFL4310 PDF预览

IRFL4310

更新时间: 2024-09-12 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关光电二极管
页数 文件大小 规格书
9页 313K
描述
Power MOSFET(Vdss=100V, Rds(on)=0.20ohm, Id=1.6A)

IRFL4310 数据手册

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PD - 91368B  
IRFL4310  
HEXFET® Power MOSFET  
D
VDSS = 100V  
RDS(on) = 0.20W  
ID = 1.6A  
l Surface Mount  
l Dynamic dv/dt Rating  
l Fast Switching  
l Ease of Paralleling  
l Advanced Process Technology  
l Ultra Low On-Resistance  
G
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The SOT-223 package is designed for surface-mount  
usingvaporphase, infrared, orwavesolderingtechniques.  
Its unique package design allows for easy automatic pick-  
and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performance  
due to an enlarged tab for heatsinking. Power dissipation  
of 1.0W is possible in a typical surface mount application.  
SOT-223  
Absolute Maximum Ratings  
Parameter  
Max.  
2.2  
1.6  
1.3  
13  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V**  
Continuous Drain Current, VGS @ 10V*  
Continuous Drain Current, VGS @ 10V*  
Pulsed Drain Current   
A
PD @TA = 25°C  
PD @TA = 25°C  
Power Dissipation (PCB Mount)**  
Power Dissipation (PCB Mount)*  
Linear Derating Factor (PCB Mount)*  
Gate-to-Source Voltage  
2.1  
1.0  
8.3  
± 20  
47  
W
W
mW/°C  
V
VGS  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
IAR  
1.6  
EAR  
Repetitive Avalanche Energy*  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
0.10  
5.0  
mJ  
V/ns  
°C  
dv/dt  
TJ,TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Junction-to-Amb. (PCB Mount, steady state)*  
Typ.  
93  
Max.  
120  
Units  
RqJA  
RqJA  
°C/W  
Junction-to-Amb. (PCB Mount, steady state)**  
48  
60  
* When mounted on FR-4 board using minimum recommended footprint.  
** When mounted on 1 inch square copper board, for comparison with other SMD devices.  
www.irf.com  
1
5/11/99  

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