IRFL110, SiHFL110
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Surface-mount
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Fast switching
• Ease of paralleling
• Simple drive requirements
SOT-223
G
D
Available
S
D
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
S
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
Marking code: FB
PRODUCT SUMMARY
The SOT-223 package is designed for surface-mounting
using vapor phase, infrared, or wave soldering techniques.
Its unique package design allows for easy automatic
pick-and-place as with other SOT or SOIC packages but
has the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation of
greater than 1.25 W is possible in a typical surface mount
application.
VDS (V)
100
RDS(on) ()
VGS = 10 V
0.54
Qg (Max.) (nC)
8.3
2.3
Q
gs (nC)
gd (nC)
Q
3.8
Configuration
Single
ORDERING INFORMATION
Package
SOT-223
SiHFL110TR-GE3 a
SiHFL110TR-BE3 a, b
IRFL110TRPBF-BE3 a, b
IRFL110TRPbF a
Lead (Pb)-free and halogen-free
Lead (Pb)-free
Notes
a. See device orientation
b. “-BE3” denotes alternate manufacturing location
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
100
20
UNIT
VDS
V
VGS
T
C = 25 °C
1.5
0.96
12
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
A
Pulsed drain current a
IDM
Linear derating factor
0.025
0.017
150
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Avalanche current a
EAS
IAR
mJ
A
1.5
Repetitive avalanche energy a
EAR
0.31
3.1
mJ
Maximum power dissipation
TC = 25 °C
PD
W
V/ns
°C
Maximum power dissipation (PCB mount) e
Peak diode recovery dv/dt c
TA = 25 °C
2.0
dV/dt
5.5
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 25 mH, Rg = 25 , IAS = 3.0 A (see fig. 12)
c. ISD 5.6 A, dI/dt 75 A/μs, VDD VDS, TJ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-1217-Rev. G, 20-Dec-2021
Document Number: 91192
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000