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IRFL024ZTRPBF

更新时间: 2024-11-16 12:28:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 269K
描述
Advanced Process Technology

IRFL024ZTRPBF 数据手册

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PD - 95312A  
IRFL024ZPbF  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
l
Advanced Process Technology  
VDSS = 55V  
UltraLowOn-Resistance  
150°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
RDS(on) = 57.5mΩ  
G
ID = 5.1A  
S
Description  
This HEXFET® Power MOSFET utilizes the latest  
processingtechniquestoachieveextremelylowon-  
resistance per silicon area. Additional features of  
thisdesign area150°Cjunctionoperatingtemperature,  
fast switching speed and improved repetitive  
avalanche rating . These features combine to make  
thisdesignanextremelyefficientandreliabledevice  
for use in a wide variety of applications.  
SOT-223  
Absolute Maximum Ratings  
Parameter  
Max.  
5.1  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TA = 25°C  
@ TA = 70°C  
D
4.1  
A
D
41  
DM  
2.8  
Power Dissipation  
P
@TA = 25°C  
@TA = 25°C  
D
D
1.0  
Power Dissipation  
W
W/°C  
V
P
0.02  
± 20  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS (Thermally limited)  
13  
32  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
-55 to + 150  
T
T
J
Storage Temperature Range  
°C  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
45  
Units  
Rθ  
Rθ  
Junction-to-Ambient (PCB mount, steady state)  
JA  
°C/W  
Junction-to-Ambient (PCB mount, steady state)  
–––  
120  
JA  
www.irf.com  
1
09/16/10  

IRFL024ZTRPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRFL024ZPBF INFINEON

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