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IRFL024Z PDF预览

IRFL024Z

更新时间: 2024-11-15 23:16:43
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关光电二极管局域网
页数 文件大小 规格书
10页 269K
描述
HEXFET Power MOSFET

IRFL024Z 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PDSO-G4Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.61
其他特性:AVALANCHE RATED, HIGH RELIABILITY外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODEFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-261AAJESD-30 代码:R-PDSO-G4
湿度敏感等级:1元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL表面贴装:YES
端子面层:NOT SPECIFIED端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFL024Z 数据手册

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PD - 95817  
IRFL024Z  
AUTOMOTIVE MOSFET  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
Advanced Process Technology  
VDSS = 55V  
UltraLowOn-Resistance  
150°COperatingTemperature  
Fast Switching  
RDS(on) = 57.5mΩ  
G
Repetitive Avalanche Allowed up to Tjmax  
ID = 5.1A  
S
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon area. Additional features of this design are a  
150°C junction operating temperature, fast switching  
speed and improved repetitive avalanche rating . These  
features combine to make this design an extremely  
efficientandreliabledeviceforuseinAutomotiveapplica-  
tions and a wide variety of other applications.  
SOT-223  
Absolute Maximum Ratings  
Parameter  
Max.  
5.1  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TA = 25°C  
@ TA = 70°C  
D
4.1  
A
D
41  
DM  
2.8  
Power Dissipation  
P
@TA = 25°C  
@TA = 25°C  
D
D
1.0  
Power Dissipation  
W
W/°C  
V
P
0.02  
± 20  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS (Thermally limited)  
13  
32  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
-55 to + 150  
T
T
J
Storage Temperature Range  
°C  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
45  
Units  
Rθ  
Rθ  
Junction-to-Ambient (PCB mount, steady state)  
JA  
°C/W  
Junction-to-Ambient (PCB mount, steady state)  
–––  
120  
JA  
www.irf.com  
1
10/25/03  

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