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IRFBC40S, SiHFBC40S, IRFBC40L, SiHFBC40L PDF预览

IRFBC40S, SiHFBC40S, IRFBC40L, SiHFBC40L

更新时间: 2024-10-17 14:55:51
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Power MOSFET

IRFBC40S, SiHFBC40S, IRFBC40L, SiHFBC40L 数据手册

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IRFBC40S, SiHFBC40S, IRFBC40L, SiHFBC40L  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface-mount (IRFBC40S, SiHFBC40S)  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
Low-profile through-hole (IRFBC40L, SiHFBC40L)  
Available in tape and reel (IRFBC40S, SiHFBC40S)  
Available  
Available  
• Dynamic dV/dt rating  
• 150 °C operating temperature  
• Fast switching  
G
G
D
S
D
S
G
• Fully avalanche rated  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
S
N-Channel MOSFET  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
600  
1.2  
60  
RDS(on) ()  
VGS = 10 V  
DESCRIPTION  
Qg max. (nC)  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
Q
gs (nC)  
gd (nC)  
8.3  
30  
Q
The D2PAK is a surface-mount power package capable of  
the accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface-mount package. The  
D2PAK is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0 W in a typical surface-mount application. The  
through-hole version (IRFBC40L, SiHFBC40L) is available  
for low-profile applications.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free SiHFBC40S-GE3  
Lead (Pb)-free IRFBC40SPbF  
Note  
D2PAK (TO-263)  
D2PAK (TO-263)  
SiHFBC40STRL-GE3 a  
IRFBC40STRLPbF a  
I2PAK (TO-262)  
SiHFBC40L-GE3  
IRFBC40LPbF  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage e  
Gate-source voltage e  
SYMBOL  
LIMIT  
600  
20  
UNIT  
VDS  
VGS  
V
TC = 25 °C  
C = 100 °C  
6.2  
3.9  
25  
Continuous drain current  
VGS at 10 V  
ID  
T
A
Pulsed drain current a, e  
IDM  
Linear derating factor  
1.0  
570  
6.2  
W/°C  
mJ  
A
Single pulse avalanche energy b, e  
Repetitive avalanche current a  
Repetitive avalanche energy a  
EAS  
IAR  
EAR  
13  
mJ  
TC = 25 °C  
TA = 25 °C  
130  
3.1  
3.0  
-55 to +150  
300  
Maximum power dissipation  
PD  
W
V/ns  
°C  
Peak diode recovery dV/dt c, e  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
dV/dt  
TJ, Tstg  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V; starting TJ = 25 °C, L = 27 mH, Rg = 25 , IAS = 6.2 A (see fig. 12)  
c. ISD 6.2 A, dI/dt 80 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. Uses IRFBC40, SiHFBC40 data and test conditions  
S21-0943-Rev. D, 20-Sep-2021  
Document Number: 91116  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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