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IRF7501TRPBF PDF预览

IRF7501TRPBF

更新时间: 2024-11-24 12:56:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
9页 184K
描述
Generation V Technology

IRF7501TRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:15 weeks风险等级:0.78
Is Samacsys:N其他特性:ULTRA LOW RESISTANCE
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (ID):2.4 A最大漏源导通电阻:0.135 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):19 A表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7501TRPBF 数据手册

 浏览型号IRF7501TRPBF的Datasheet PDF文件第2页浏览型号IRF7501TRPBF的Datasheet PDF文件第3页浏览型号IRF7501TRPBF的Datasheet PDF文件第4页浏览型号IRF7501TRPBF的Datasheet PDF文件第5页浏览型号IRF7501TRPBF的Datasheet PDF文件第6页浏览型号IRF7501TRPBF的Datasheet PDF文件第7页 
PD - 95345A  
IRF7501PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ulrtra Low On-Resistance  
l Dual N-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (<1.1mm)  
l Available in Tape & Reel  
l Fast Switching  
1
2
3
4
8
S1  
G1  
D1  
VDSS =20V  
7
D1  
6
S2  
G2  
D2  
5
D2  
RDS(on) = 0.135Ω  
Top View  
l Lead-Free  
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve extremely low on-resistance per silicon  
area. This benefit, combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable device for use in a wide variety  
of applications.  
The new Micro8 package, with half the footprint area of the standard SO-8,  
provides the smallest footprint available in an SOIC outline. This makes the  
Micro8 an ideal device for applications where printed circuit board space is  
at a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily  
into extremely thin application environments such as portable electronics and  
PCMCIA cards.  
Micro8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
20  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
2.4  
1.9  
A
19  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation „  
Linear Derating Factor  
1.25  
0.8  
W
W
0.01  
16  
W/°C  
V
VGSM  
Gate-to-Source Voltage Single Pulse tp<10μs  
Gate-to-Source Voltage  
VGS  
± 12  
5.0  
V
dv/dt  
Peak Diode Recovery dv/dt ‚  
Operating Junction and Storage Temperature Range  
Soldering Temperature, for 10 seconds  
V/ns  
°C  
TJ , TSTG  
-55 to + 150  
240 (1.6mm from case)  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
100  
°C/W  
All Micro8 Data Sheets reflect improved Thermal Resistance, Power and Current -Handling Ratings- effective  
only for product marked with Date Code 505 or later .  
www.irf.com  
1
02/13/12  

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