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IRF7509PBF PDF预览

IRF7509PBF

更新时间: 2024-11-20 03:15:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 242K
描述
HEXFET㈢Power MOSFET

IRF7509PBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:MICRO8, SOIC-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.11
Is Samacsys:N其他特性:ULTRA LOW RESISTANCE
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):1.3 A最大漏极电流 (ID):2.7 A
最大漏源导通电阻:0.11 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL AND P-CHANNEL最大功率耗散 (Abs):0.39 W
最大脉冲漏极电流 (IDM):21 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7509PBF 数据手册

 浏览型号IRF7509PBF的Datasheet PDF文件第2页浏览型号IRF7509PBF的Datasheet PDF文件第3页浏览型号IRF7509PBF的Datasheet PDF文件第4页浏览型号IRF7509PBF的Datasheet PDF文件第5页浏览型号IRF7509PBF的Datasheet PDF文件第6页浏览型号IRF7509PBF的Datasheet PDF文件第7页 
PD - 95397  
IRF7509PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l Dual N and P Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (<1.1mm)  
l Available in Tape & Reel  
l Fast Switching  
N-CHANNEL MOSFET  
1
2
3
4
8
D1  
S1  
N-Ch P-Ch  
7
G1  
D1  
6
5
VDSS 30V -30V  
S2  
D2  
G2  
D2  
P-CHANNEL MOSFET  
RDS(on) 0.110.20Ω  
Top View  
l Lead-Free  
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve extremely low on-resistance per silicon  
area. This benefit, combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable device for use in a wide variety  
of applications.  
The new Micro8 package, with half the footprint area of the standard SO-8,  
provides the smallest footprint available in an SOIC outline. This makes the  
Micro8 an ideal device for applications where printed circuit board space is at  
a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into  
extremely thin application environments such as portable electronics and  
PCMCIA cards.  
Micro8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
N-Channel  
P-Channel  
VDS  
Drain-Source Voltage  
30  
2.7  
2.1  
21  
-30  
-2.0  
-1.6  
-16  
V
A
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS  
Continuous Drain Current, VGS  
Pulsed Drain Current  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation„  
Linear Derating Factor  
1.25  
W
W
0.8  
10  
± 20  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
VGSM  
dv/dt  
Gate-to-Source Voltage Single Pulse tp<10µS  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
Soldering Temperature, for 10 seconds  
30  
V
5.0  
V/ns  
°C  
TJ , TSTG  
-55 to + 150  
240 (1.6mm from case)  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient „  
Max.  
100  
Units  
°C/W  
RθJA  
www.irf.com  
1
6/15/04  

IRF7509PBF 替代型号

型号 品牌 替代类型 描述 数据表
IRF7509 INFINEON

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