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IRF7534D1 PDF预览

IRF7534D1

更新时间: 2024-11-23 22:13:27
品牌 Logo 应用领域
英飞凌 - INFINEON 肖特基二极管
页数 文件大小 规格书
8页 107K
描述
FETKY MOSFET & Schottky Diode(Vdss=-20V, Rds(on)=0.055ohm, Schottky Vf=0.39V)

IRF7534D1 数据手册

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PD-93864  
IRF7534D1  
FETKY MOSFET & Schottky Diode  
®
Co-packaged HEXFET power  
1
8
7
K
K
A
MOSFET and Schottky diode  
Ultra Low On-Resistance  
MOSFET  
VDSS = -20V  
2
A
3
4
6
5
S
D
D
RDS(on) = 0.055  
Schottky Vf=0.39V  
Trench technology  
Micro8TM Footprint  
G
Available in Tape & Reel  
Top View  
Description  
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the designer  
an innovative, board space saving solution for switching regulator and power  
management applications. International Rectifier utilizes advanced processing  
techniques to achieve extremely low on-resistance per silicon area. Combining this  
technology with International Rectifier’s low forward drop Schottky rectifiers results in  
an extremely efficient device suitable for use in a wide variety of portable electronics  
applications, such as cell phones, PDAs, etc.  
Micro8  
The Micro8TM package makes an ideal device for applications where printed circuit  
board space is at a premium. The low profile (<1.1mm) of the Micro8TM will allow it to  
fit easily into extremely thin application environments such as portable electronics  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current  
-4.3  
-3.4  
-34  
A
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation„  
Linear Derating Factor  
1.25  
0.8  
W
W
10  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
1.1  
V/ns  
°C  
TJ , TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
100  
°C/W  
Notes:  
 Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)  
‚ ISD -1.2A, di/dt 100A/µs, VDD V(BR)DSS, TJ 150°C  
ƒ Pulse width 300µs – duty cycle 2%  
„
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance  
www.irf.com  
1
3/22/00  

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