PD-93864
IRF7534D1
FETKY MOSFET & Schottky Diode
®
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Co-packaged HEXFET power
1
8
7
K
K
A
MOSFET and Schottky diode
Ultra Low On-Resistance
MOSFET
VDSS = -20V
2
A
3
4
6
5
S
D
D
RDS(on) = 0.055Ω
Schottky Vf=0.39V
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Trench technology
Micro8TM Footprint
G
Available in Tape & Reel
Top View
Description
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the designer
an innovative, board space saving solution for switching regulator and power
management applications. International Rectifier utilizes advanced processing
techniques to achieve extremely low on-resistance per silicon area. Combining this
technology with International Rectifier’s low forward drop Schottky rectifiers results in
an extremely efficient device suitable for use in a wide variety of portable electronics
applications, such as cell phones, PDAs, etc.
Micro8
The Micro8TM package makes an ideal device for applications where printed circuit
board space is at a premium. The low profile (<1.1mm) of the Micro8TM will allow it to
fit easily into extremely thin application environments such as portable electronics
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Max.
-20
Units
V
VDS
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ -4.5V
Continuous Drain Current, VGS @ -4.5V
Pulsed Drain Current
-4.3
-3.4
-34
A
PD @TA = 25°C
PD @TA = 70°C
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
1.25
0.8
W
W
10
mW/°C
V
VGS
Gate-to-Source Voltage
± 12
dv/dt
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
1.1
V/ns
°C
TJ , TSTG
-55 to + 150
Thermal Resistance
Parameter
Max.
Units
RθJA
Maximum Junction-to-Ambient
100
°C/W
Notes:
Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)
ISD ≤ -1.2A, di/dt ≤ 100A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C
Pulse width ≤ 300µs – duty cycle ≤ 2%
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
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