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IRF7524D1GPBF PDF预览

IRF7524D1GPBF

更新时间: 2024-11-06 11:09:27
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体肖特基二极管晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 198K
描述
FETKY MOSFET & Schottky Diode

IRF7524D1GPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE, MO-187AA, MICRO-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.37
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):1.7 A最大漏极电流 (ID):1.7 A
最大漏源导通电阻:0.27 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.25 W最大脉冲漏极电流 (IDM):14 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF7524D1GPBF 数据手册

 浏览型号IRF7524D1GPBF的Datasheet PDF文件第2页浏览型号IRF7524D1GPBF的Datasheet PDF文件第3页浏览型号IRF7524D1GPBF的Datasheet PDF文件第4页浏览型号IRF7524D1GPBF的Datasheet PDF文件第5页浏览型号IRF7524D1GPBF的Datasheet PDF文件第6页浏览型号IRF7524D1GPBF的Datasheet PDF文件第7页 
PD-96176  
IRF7524D1GPbF  
TM  
FETKY MOSFET & Schottky Diode  
l Co-packaged HEXFET® Power  
MOSFET and Schottky Diode  
l P-Channel HEXFET  
1
2
3
4
8
K
K
A
VDSS = -20V  
RDS(on) = 0.27  
Schottky Vf = 0.39V  
7
A
l Low VF Schottky Rectifier  
l Generation 5 Technology  
6
5
S
D
D
TM  
l Micro8 Footprint  
G
l Lead-Free  
l Halogen-Free  
Top View  
Description  
The FETKYTM family of co-packaged HEXFETs and Schottky diodes offer the  
designer an innovative board space saving solution for switching regulator  
applications. Generation 5 HEXFETs utilize advanced processing techniques to  
achieve extremely low on-resistance per silicon area. Combining this technology  
with International Rectifier's low forward drop Schottky rectifiers results in an  
extremely efficient device suitable for use in a wide variety of portable electronics  
applications like cell phone, PDA, etc.  
Micro8TM  
ThenewMicro8TM package, withhalfthefootprintareaofthestandardSO-8, provides  
the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal  
device for applications where printed circuit board space is at a premium. The low  
profile (<1.1mm) of the Micro8TM will allow it to fit easily into extremely thin application  
environments such as portable electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Maximum  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
-1.7  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-1.4  
-14  
A
PD @TA = 25°C  
PD @TA = 70°C  
1.25  
W
Power Dissipation  
0.8  
Linear Derating Factor  
10  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
-5.0  
V/ns  
°C  
TJ, TSTG  
-55 to +150  
Thermal Resistance Ratings  
Parameter  
Maximum  
Units  
RθJA  
Junction-to-Ambient „  
100  
°C/W  
Notes:  
 Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)  
‚ ISD -1.2A, di/dt 100A/µs, VDD V(BR)DSS, TJ 150°C  
ƒ Pulse width 300µs – duty cycle 2%  
„
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance  
www.irf.com  
1
09/16/08  

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