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IRF7530 PDF预览

IRF7530

更新时间: 2024-11-19 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 84K
描述
Power MOSFET(Vdss=20V, Rds(on)=0.030ohm)

IRF7530 数据手册

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PD-93760B  
IRF7530  
HEXFET® Power MOSFET  
Trench Technology  
1
2
8
D1  
S1  
Ultra Low On-Resistance  
Dual N-Channel MOSFET  
Very Small SOIC Package  
Low Profile (<1.1mm)  
Available in Tape & Reel  
VDSS = 20V  
7
6
5
G 1  
D 1  
3
4
S2  
D2  
D 2  
G 2  
RDS(on) = 0.030Ω  
Top View  
Description  
New trench HEXFET power MOSFETs from International  
Rectifier utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the ruggedized device design that HEXFET  
Power MOSFETs are well known for, provides the designer  
withanextremelyefficientandreliabledeviceforuseinawide  
varietyofapplications.  
The new Micro8 package has half the footprint area of the  
standard SO-8. This makes the Micro8 an ideal device for  
applicationswhereprintedcircuitboardspaceisatapremium.  
Thelowprofile(<1.1mm)oftheMicro8willallowittofiteasily  
intoextremelythinapplicationenvironmentssuchasportable  
electronics and PCMCIA cards.  
Micro8  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
5.4  
4.3  
40  
A
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.3  
0.80  
10  
W
Power Dissipation  
Linear Derating Factor  
mW/°C  
mJ  
EAS  
Single Pulse Avalanche Energy„  
Gate-to-Source Voltage  
33  
VGS  
± 12  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
100  
Units  
°C/W  
RθJA  
www.irf.com  
1
02/16/01  

IRF7530 替代型号

型号 品牌 替代类型 描述 数据表
IRF7530PBF INFINEON

完全替代

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