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IRF7509PBF-1 PDF预览

IRF7509PBF-1

更新时间: 2024-11-24 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 236K
描述
Small Signal Field-Effect Transistor,

IRF7509PBF-1 数据手册

 浏览型号IRF7509PBF-1的Datasheet PDF文件第2页浏览型号IRF7509PBF-1的Datasheet PDF文件第3页浏览型号IRF7509PBF-1的Datasheet PDF文件第4页浏览型号IRF7509PBF-1的Datasheet PDF文件第5页浏览型号IRF7509PBF-1的Datasheet PDF文件第6页浏览型号IRF7509PBF-1的Datasheet PDF文件第7页 
IRF7509PbF-1  
HEXFET® Power MOSFET  
N-CH P-CH  
N-CHANNEL MOSFET  
1
2
3
4
8
D1  
D1  
S1  
VDS  
30  
0.11  
7.8  
-30  
V
Ω
7
RDS(on) max  
(@VGS = 10V)  
Qg (typical)  
ID  
G1  
0.2  
6
5
S2  
D2  
7.5  
-2.0  
nC  
A
G2  
D2  
2.7  
P-CHANNEL MOSFET  
(@TA = 25°C)  
Micro8  
Top View  
Features  
Benefits  
Industry-standard pinout Micro-8 Package  
Multi-Vendor Compatibility  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
MSL1, Industrial qualification  
Easier Manufacturing  
Environmentally Friendlier  
Increased Reliability  
Standard Pack  
Form  
Base Part Number  
Package Type  
Orderable Part Number  
Quantity  
Tube/Bulk  
Tape and Reel  
95  
4000  
IRF7509PbF-1  
IRF7509TRPbF-1  
IRF7509PbF-1  
Micro-8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
N-Channel  
P-Channel  
-30  
VDS  
Drain-Source Voltage  
30  
2.7  
2.1  
21  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS  
Continuous Drain Current, VGS  
Pulsed Drain Current  
-2.0  
-1.6  
A
-16  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation„  
Linear Derating Factor  
1.25  
0.8  
10  
W
W
mW/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
30  
VGSM  
dv/dt  
Gate-to-Source Voltage Single Pulse tp<10μS  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
Soldering Temperature, for 10 seconds  
V
5.0  
V/ns  
°C  
TJ , TSTG  
-55 to + 150  
240 (1.6mm from case)  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
100  
°C/W  
1
www.irf.com © 2014 International Rectifier  
Submit Datasheet Feedback  
June 27, 2014  

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