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IRF7509 PDF预览

IRF7509

更新时间: 2024-11-23 22:31:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
8页 218K
描述
Power MOSFET(Vdss=+-30V)

IRF7509 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:SOIC-8Reach Compliance Code:compliant
风险等级:5.7Is Samacsys:N
其他特性:ULTRA LOW RESISTANCE配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):2.7 A
最大漏源导通电阻:0.11 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-G8元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL AND P-CHANNEL表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF7509 数据手册

 浏览型号IRF7509的Datasheet PDF文件第2页浏览型号IRF7509的Datasheet PDF文件第3页浏览型号IRF7509的Datasheet PDF文件第4页浏览型号IRF7509的Datasheet PDF文件第5页浏览型号IRF7509的Datasheet PDF文件第6页浏览型号IRF7509的Datasheet PDF文件第7页 
PD - 91270J  
IRF7509  
HEXFET® Power MOSFET  
Generation V Technology  
Ultra Low On-Resistance  
Dual N and P Channel MOSFET  
Very Small SOIC Package  
Low Profile (<1.1mm)  
N-CHANNEL M OSFET  
1
8
D1  
S1  
N-Ch P-Ch  
2
7
G 1  
D 1  
3
4
6
5
VDSS 30V -30V  
S2  
D 2  
Available in Tape & Reel  
Fast Switching  
G 2  
D 2  
P-CHANNEL M OSFET  
RDS(on) 0.110.20Ω  
Top View  
Description  
Fifth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve extremely low on-resistance per silicon  
area. This benefit, combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable device for use in a wide variety  
of applications.  
The new Micro8 package, with half the footprint area of the standard SO-8,  
provides the smallest footprint available in an SOIC outline. This makes the  
Micro8 an ideal device for applications where printed circuit board space is at  
a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into  
extremely thin application environments such as portable electronics and  
PCMCIA cards.  
Micro8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
N-Channel  
P-Channel  
VDS  
Drain-Source Voltage  
30  
2.7  
2.1  
21  
-30  
-2.0  
-1.6  
-16  
V
A
ID @ TA = 25°C  
Continuous Drain Current, VGS  
Continuous Drain Current, VGS  
Pulsed Drain Current  
ID @ TA = 70°C  
IDM  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation„  
Linear Derating Factor  
1.25  
W
W
0.8  
10  
± 20  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
VGSM  
dv/dt  
Gate-to-Source Voltage Single Pulse tp<10µS  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
Soldering Temperature, for 10 seconds  
30  
V
5.0  
V/ns  
°C  
TJ , TSTG  
-55 to + 150  
240 (1.6mm from case)  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
100  
°C/W  
www.irf.com  
1
12/1/98  

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