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IRF7413APBF PDF预览

IRF7413APBF

更新时间: 2024-11-21 21:19:59
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 236K
描述
Power Field-Effect Transistor, 12A I(D), 30V, 0.0135ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA,

IRF7413APBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.27
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):260 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):12 A
最大漏源导通电阻:0.0135 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MS-012AAJESD-30 代码:R-PDSO-G8
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.5 W
最大脉冲漏极电流 (IDM):58 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF7413APBF 数据手册

 浏览型号IRF7413APBF的Datasheet PDF文件第2页浏览型号IRF7413APBF的Datasheet PDF文件第3页浏览型号IRF7413APBF的Datasheet PDF文件第4页浏览型号IRF7413APBF的Datasheet PDF文件第5页浏览型号IRF7413APBF的Datasheet PDF文件第6页浏览型号IRF7413APBF的Datasheet PDF文件第7页 
PD - 95303  
IRF7413APbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l N-ChannelMosfet  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
A
A
D
1
2
3
4
8
S
S
S
G
7
VDSS = 30V  
D
6
D
5
D
RDS(on) = 0.0135Ω  
l Lead-Free  
Top View  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of power  
applications. With these improvements, multiple devices  
can be used in an application with dramatically reduced  
board space. The package is designed for vapor phase,  
infra red, or wave soldering techniques. Power dissipation  
of greater than 0.8W is possible in a typical PCB mount  
application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
12  
8.4  
58  
A
PD @TA = 25°C  
Power Dissipation  
2.5  
W
mW/°C  
V
Linear Derating Factor  
0.02  
± 20  
260  
5.0  
VGS  
Gate-to-Source Voltage  
EAS  
Single Pulse Avalanche Energy‚  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
mJ  
dv/dt  
TJ,TSTG  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient†  
–––  
50  
°C/W  
9/30/04  

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种类:N-Channel;漏源电压(Vdss):30V;持续漏极电流(Id)(在25°C时