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IRF7380QPBF_10 PDF预览

IRF7380QPBF_10

更新时间: 2024-11-06 12:30:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 206K
描述
Advanced Process Technology Ultra Low On-Resistance

IRF7380QPBF_10 数据手册

 浏览型号IRF7380QPBF_10的Datasheet PDF文件第2页浏览型号IRF7380QPBF_10的Datasheet PDF文件第3页浏览型号IRF7380QPBF_10的Datasheet PDF文件第4页浏览型号IRF7380QPBF_10的Datasheet PDF文件第5页浏览型号IRF7380QPBF_10的Datasheet PDF文件第6页浏览型号IRF7380QPBF_10的Datasheet PDF文件第7页 
PD - 96132B  
IRF7380QPbF  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
NChannelMOSFET  
SurfaceMount  
Available in Tape & Reel  
150°COperatingTemperature  
Lead-Free  
VDSS  
80V  
RDS(on) max  
ID  
73m @VGS = 10V  
2.2A  
1
2
3
4
8
S1  
G1  
D1  
7
Description  
D1  
Additional features of These HEXFET Power  
MOSFET's are a 150°C junction operating  
temperature,fast switchingspeedandimproved  
repetitive avalanche rating. These benefits  
combine to make this design an extremely  
efficient and reliable device for use in a wide  
variety of applications.  
6
S2  
D2  
5
G2  
D2  
SO-8  
Top View  
The efficient SO-8 package provides enhanced  
thermalcharacteristicsmakingitidealinavariety  
of power applications. This surface mount SO-8  
candramaticallyreduceboardspaceandisalso  
available in Tape & Reel.  
Absolute Maximum Ratings  
Parameter  
Max.  
80  
Units  
V
VDS  
VGS  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
± 20  
3.6  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ T = 25°C  
A
D
D
@ T = 100°C  
A
2.9  
29  
A
DM  
P
@T = 25°C  
A
Maximum Power Dissipation  
Linear Derating Factor  
2.0  
W
D
0.02  
2.3  
-55 to + 150  
W/°C  
dv/dt  
Peak Diode Recovery dv/dt  
Operating Junction and  
V/ns  
°C  
T
J
T
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Drain Lead  
Junction-to-Ambient (PCB Mount) *  
Typ.  
–––  
Max.  
42  
Units  
°C/W  
RθJL  
RθJA  
–––  
50  
Notes  through †are on page 8  
www.irf.com  
1
08/09/10  

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