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IRF630NPBF_15

更新时间: 2024-11-19 01:19:11
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英飞凌 - INFINEON /
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11页 340K
描述
Advanced Process Technology

IRF630NPBF_15 数据手册

 浏览型号IRF630NPBF_15的Datasheet PDF文件第2页浏览型号IRF630NPBF_15的Datasheet PDF文件第3页浏览型号IRF630NPBF_15的Datasheet PDF文件第4页浏览型号IRF630NPBF_15的Datasheet PDF文件第5页浏览型号IRF630NPBF_15的Datasheet PDF文件第6页浏览型号IRF630NPBF_15的Datasheet PDF文件第7页 
PD - 95047A  
IRF630NPbF  
IRF630NSPbF  
IRF630NLPbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS = 200V  
l Fully Avalanche Rated  
l Ease of Paralleling  
l Simple Drive Requirements  
l Lead-Free  
RDS(on) = 0.30Ω  
G
Description  
ID = 9.3A  
Fifth Generation HEXFET® Power MOSFETs from  
S
InternationalRectifierutilizeadvancedprocessingtechniques  
to achieve extremely low on-resistance per silicon area.  
This benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power MOSFETs  
are well known for, provides the designer with an extremely  
efficient and reliable device for use in a wide variety of  
applications.  
The TO-220 package is universally preferred for all  
commercial-industrialapplicationsatpowerdissipationlevels  
to approximately 50 watts. The low thermal resistance and  
low package cost of the TO-220 contribute to its wide  
acceptance throughout the industry.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
2.0W in a typical surface mount application.  
D2Pak  
IRF630NSPbF IRF630NLPbF  
TO-262  
TO-220AB  
IRF630NPbF  
The through-hole version (IRF630NL) is available for low-  
profile application.  
Absolute Maximum Ratings  
Parameter  
Max.  
9.3  
6.5  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
37  
PD @TC = 25°C  
Power Dissipation  
82  
W
W/°C  
V
Linear Derating Factor  
0.5  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±20  
Single Pulse Avalanche Energy‚  
Avalanche Current  
94  
mJ  
A
9.3  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt †  
Operating Junction and  
8.2  
mJ  
V/ns  
8.1  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew„  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
www.irf.com  
1
07/23/10  

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