PD - 95047A
IRF630NPbF
IRF630NSPbF
IRF630NLPbF
HEXFET® Power MOSFET
l Advanced Process Technology
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
D
VDSS = 200V
l Fully Avalanche Rated
l Ease of Paralleling
l Simple Drive Requirements
l Lead-Free
RDS(on) = 0.30Ω
G
Description
ID = 9.3A
Fifth Generation HEXFET® Power MOSFETs from
S
InternationalRectifierutilizeadvancedprocessingtechniques
to achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 package is universally preferred for all
commercial-industrialapplicationsatpowerdissipationlevels
to approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of its
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
D2Pak
IRF630NSPbF IRF630NLPbF
TO-262
TO-220AB
IRF630NPbF
The through-hole version (IRF630NL) is available for low-
profile application.
Absolute Maximum Ratings
Parameter
Max.
9.3
6.5
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
37
PD @TC = 25°C
Power Dissipation
82
W
W/°C
V
Linear Derating Factor
0.5
VGS
EAS
IAR
Gate-to-Source Voltage
±20
Single Pulse Avalanche Energy
Avalanche Current
94
mJ
A
9.3
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
8.2
mJ
V/ns
8.1
-55 to +175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
°C
300 (1.6mm from case )
10 lbf•in (1.1N•m)
www.irf.com
1
07/23/10