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IRF630NS PDF预览

IRF630NS

更新时间: 2024-11-17 22:31:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
11页 155K
描述
Power MOSFET(Vdss=200V, Rds(on)=0.30ohm, Id=9.3A)

IRF630NS 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.04
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):94 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):9.3 A
最大漏源导通电阻:0.3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e0湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):225极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):37 A认证状态:Not Qualified
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF630NS 数据手册

 浏览型号IRF630NS的Datasheet PDF文件第2页浏览型号IRF630NS的Datasheet PDF文件第3页浏览型号IRF630NS的Datasheet PDF文件第4页浏览型号IRF630NS的Datasheet PDF文件第5页浏览型号IRF630NS的Datasheet PDF文件第6页浏览型号IRF630NS的Datasheet PDF文件第7页 
PD - 94005A  
IRF630N  
IRF630NS  
IRF630NL  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS = 200V  
l Fully Avalanche Rated  
l Ease of Paralleling  
RDS(on) = 0.30Ω  
G
l Simple Drive Requirements  
Description  
ID = 9.3A  
Fifth Generation HEXFET® Power MOSFETs from  
S
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance per  
silicon area. This benefit, combined with the fast switching  
speed and ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer with an  
extremely efficient and reliable device for use in a wide  
variety of applications.  
The TO-220 package is universally preferred for all  
commercial-industrialapplicationsatpowerdissipationlevels  
to approximately 50 watts. The low thermal resistance and  
low package cost of the TO-220 contribute to its wide  
acceptance throughout the industry.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
2.0W in a typical surface mount application.  
D2Pak  
IRF630NS  
TO-262  
IRF630NL  
TO-220AB  
IRF630N  
The through-hole version (IRF630NL) is available for low-  
profile application.  
Absolute Maximum Ratings  
Parameter  
Max.  
9.3  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
6.5  
A
37  
PD @TC = 25°C  
Power Dissipation  
82  
W
W/°C  
V
Linear Derating Factor  
0.5  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±20  
94  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
9.3  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt †  
Operating Junction and  
8.2  
mJ  
V/ns  
8.1  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew„  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
www.irf.com  
1
10/11/00  

IRF630NS 替代型号

型号 品牌 替代类型 描述 数据表
IRF630NSTRLPBF INFINEON

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IRF630NSTRRPBF INFINEON

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Power Field-Effect Transistor, 9.3A I(D), 200V, 0.3ohm, 1-Element, N-Channel, Silicon, Met
IRF630NSPBF INFINEON

类似代替

HEXFET Power MOSFET

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