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IRF1010EZSTRRPBF PDF预览

IRF1010EZSTRRPBF

更新时间: 2024-11-18 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
12页 398K
描述
Power Field-Effect Transistor, 75A I(D), 60V, 0.0085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, LEAD FREE, PLASTIC, D2PAK-3

IRF1010EZSTRRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.03
其他特性:AVALANCHE RATED, ULTRA LOW RESISTANCE雪崩能效等级(Eas):99 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):75 A
最大漏极电流 (ID):75 A最大漏源导通电阻:0.0085 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):140 W
最大脉冲漏极电流 (IDM):340 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF1010EZSTRRPBF 数据手册

 浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第2页浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第3页浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第4页浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第5页浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第6页浏览型号IRF1010EZSTRRPBF的Datasheet PDF文件第7页 
PD - 95483B  
IRF1010EZPbF  
AUTOMOTIVE MOSFET  
IRF1010EZSPbF  
IRF1010EZLPbF  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
D
VDSS = 60V  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
RDS(on) = 8.5mΩ  
G
ID = 75A  
Description  
S
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistance per silicon area. Additional fea-  
tures of this design are a 175°C junction operat-  
ing temperature, fast switching speed and im-  
proved repetitive avalanche rating . These fea-  
tures combine to make this design an extremely  
efficient and reliable device for use in Automotive  
applications and a wide variety of other applica-  
tions.  
D2Pak  
TO-262  
TO-220AB  
IRF1010EZPbF  
IRF1010EZSPbF IRF1010EZLPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
84  
Units  
A
I
I
I
I
@ TC = 25°C  
@ TC = 100°C  
@ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
D
D
D
60  
Continuous Drain Current, VGS @ 10V (See Fig. 9)  
75  
(Package Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
340  
140  
DM  
P
@TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
D
0.90  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS  
99  
180  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested)  
IAR  
See Fig.12a,12b,15,16  
A
EAR  
mJ  
°C  
Repetitive Avalanche Energy  
T
J
-55 to + 175  
Operating Junction and  
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.11  
–––  
62  
Units  
°C/W  
Rθ  
JC  
CS  
JA  
JA  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
0.50  
–––  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
09/17/09  

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