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IRF1018ESLPBF PDF预览

IRF1018ESLPBF

更新时间: 2024-11-21 04:04:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 430K
描述
HEXFET Power MOSFET

IRF1018ESLPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, TO-262, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:8.45
雪崩能效等级(Eas):88 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):79 A最大漏极电流 (ID):79 A
最大漏源导通电阻:0.0084 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-262AAJESD-30 代码:R-PSIP-T3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):110 W
最大脉冲漏极电流 (IDM):315 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF1018ESLPBF 数据手册

 浏览型号IRF1018ESLPBF的Datasheet PDF文件第2页浏览型号IRF1018ESLPBF的Datasheet PDF文件第3页浏览型号IRF1018ESLPBF的Datasheet PDF文件第4页浏览型号IRF1018ESLPBF的Datasheet PDF文件第5页浏览型号IRF1018ESLPBF的Datasheet PDF文件第6页浏览型号IRF1018ESLPBF的Datasheet PDF文件第7页 
PD - 97125  
IRF1018EPbF  
IRF1018ESPbF  
IRF1018ESLPbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in  
D
S
SMPS  
VDSS  
RDS(on) typ.  
max.  
60V  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
7.1m  
8.4m  
:
:
G
ID  
79A  
Benefits  
l Improved Gate, Avalanche and Dynamic  
dv/dt Ruggedness  
l Fully Characterized Capacitance and  
Avalanche SOA  
D
D
D
l Enhanced body diode dV/dt and dI/dt  
Capability  
S
S
S
D
D
D
G
G
G
D2Pak  
IRF1018ESPbF  
TO-262  
IRF1018ESLPbF  
TO-220AB  
IRF1018EPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
Max.  
79  
Units  
56  
A
315  
110  
0.76  
± 20  
21  
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
Gate-to-Source Voltage  
Peak Diode Recovery e  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw k  
Avalanche Characteristics  
Single Pulse Avalanche Energy d  
EAS (Thermally limited)  
88  
47  
11  
mJ  
A
Avalanche Current c  
IAR  
Repetitive Avalanche Energy f  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
Junction-to-Case j  
1.32  
–––  
62  
Case-to-Sink, Flat Greased Surface , TO-220  
Junction-to-Ambient, TO-220 j  
Junction-to-Ambient (PCB Mount) , D2Pak ij  
0.50  
–––  
°C/W  
–––  
40  
www.irf.com  
1
2/28/08  

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