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IRF1010ZLPBF

更新时间: 2024-09-14 04:23:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 355K
描述
HEXFET㈢ Power MOSFET

IRF1010ZLPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.57峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

IRF1010ZLPBF 数据手册

 浏览型号IRF1010ZLPBF的Datasheet PDF文件第2页浏览型号IRF1010ZLPBF的Datasheet PDF文件第3页浏览型号IRF1010ZLPBF的Datasheet PDF文件第4页浏览型号IRF1010ZLPBF的Datasheet PDF文件第5页浏览型号IRF1010ZLPBF的Datasheet PDF文件第6页浏览型号IRF1010ZLPBF的Datasheet PDF文件第7页 
PD - 95361  
IRF1010ZPbF  
IRF1010ZSPbF  
IRF1010ZLPbF  
AUTOMOTIVE MOSFET  
Features  
HEXFET® Power MOSFET  
l
l
l
l
l
Advanced Process Technology  
D
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
VDSS = 55V  
Repetitive Avalanche Allowed up to Tjmax  
RDS(on) = 7.5mΩ  
G
l
Lead-Free  
Description  
ID = 75A  
Specifically designed for Automotive applications,  
S
this HEXFET® Power MOSFET utilizes the latest  
processingtechniquestoachieveextremelylowon-  
resistance per silicon area. Additional features of  
thisdesign area175°Cjunctionoperatingtempera-  
ture, fast switching speed and improved repetitive  
avalanche rating . These features combine to make  
thisdesignanextremelyefficientandreliabledevice  
foruseinAutomotiveapplicationsandawidevariety  
of other applications.  
D2Pak  
IRF1010ZS  
TO-262  
IRF1010ZL  
TO-220AB  
IRF1010Z  
Absolute Maximum Ratings  
Parameter  
Max.  
94  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
66  
A
@ T = 25°C  
C
75  
360  
140  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
0.90  
± 20  
W/°C  
V
V
GS  
EAS (Thermally limited)  
130  
180  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.11  
–––  
62  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
RθJA  
0.50  
–––  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount)  
www.irf.com  
1
6/3/04  

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