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IRF1010Z PDF预览

IRF1010Z

更新时间: 2024-11-20 22:33:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
12页 301K
描述
AUTOMOTIVE MOSFET

IRF1010Z 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.65Is Samacsys:N
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE雪崩能效等级(Eas):130 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (ID):75 A
最大漏源导通电阻:0.0075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):360 A表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF1010Z 数据手册

 浏览型号IRF1010Z的Datasheet PDF文件第2页浏览型号IRF1010Z的Datasheet PDF文件第3页浏览型号IRF1010Z的Datasheet PDF文件第4页浏览型号IRF1010Z的Datasheet PDF文件第5页浏览型号IRF1010Z的Datasheet PDF文件第6页浏览型号IRF1010Z的Datasheet PDF文件第7页 
PD - 94652A  
IRF1010Z  
IRF1010ZS  
IRF1010ZL  
AUTOMOTIVE MOSFET  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
D
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
VDSS = 55V  
Repetitive Avalanche Allowed up to Tjmax  
RDS(on) = 7.5mΩ  
G
Description  
ID = 75A  
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processingtechniquestoachieveextremelylowon-  
resistance per silicon area. Additional features of  
thisdesign area175°Cjunctionoperatingtempera-  
ture, fast switching speed and improved repetitive  
avalanche rating . These features combine to make  
thisdesignanextremelyefficientandreliabledevice  
foruseinAutomotiveapplicationsandawidevariety  
of other applications.  
S
D2Pak  
TO-262  
IRF1010ZL  
TO-220AB  
IRF1010Z  
IRF1010ZS  
Absolute Maximum Ratings  
Parameter  
Max.  
94  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
66  
A
@ T = 25°C  
C
75  
360  
140  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
0.90  
± 20  
W/°C  
V
V
GS  
EAS (Thermally limited)  
130  
180  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.11  
–––  
62  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
RθJA  
0.50  
–––  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount)  
www.irf.com  
1
9/8/03  

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