S E M I C O N D U C T O R
HGTG30N60C3D
63A, 600V, UFS Series N-Channel IGBT
with Anti-Parallel Hyperfast Diode
August 1995
Features
Package
• 63A, 600V at TC = +25oC
JEDEC STYLE TO-247
• Typical Fall Time - 230ns at TJ = +150oC
E
C
• Short Circuit Rating
G
• Low Conduction Loss
• Hyperfast Anti-Parallel Diode
Description
The HGTG30N60C3D is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. The device has the high input impedance of a MOS-
FET and the low on-state conduction loss of a bipolar transistor.
The much lower on-state voltage drop varies only moderately
between +25oC and +150oC. The IGBT used is the development
type TA49051. The diode used in anti-parallel with the IGBT is
the development type TA49053.
Terminal Diagram
N-CHANNEL ENHANCEMENT MODE
C
The IGBT is ideal for many high voltage switching applications
operating at moderate frequencies where low conduction
losses are essential.
G
PACKAGING AVAILABILITY
PART NUMBER
PACKAGE
TO-247
BRAND
G30N60C3D
E
HGTG30N60C3D
NOTE: When ordering, use the entire part number.
Formerly Developmental Type TA49014.
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified
C
HGTG30N60C3D
UNITS
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
600
V
CES
Collector Current Continuous
o
At T = +25 C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
63
30
25
252
±20
A
A
A
A
V
V
C
C25
C110
o
At T = +110 C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Average Diode Forward Current at +110 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Switching Safe Operating Area at T = +150 C . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . .T , T
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 2) at V = 15V . . . . . . . . . . . . . . . . . . . . . . . . . . t
Short Circuit Withstand Time (Note 2) at V = 10V . . . . . . . . . . . . . . . . . . . . . . . . . . t
C
o
(AVG)
CM
GES
GEM
±30
o
60A at 600V
208
1.67
-40 to +150
260
J
o
W
C
D
o
o
W/ C
C
o
C
C
J
STG
o
L
SC
SC
4
15
µs
µs
GE
GE
NOTE:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
o
2. V
= 360V, T = +125 C, R = 25Ω.
CE(PK)
J
GE
HARRIS SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:
4,364,073
4,417,385
4,598,461
4,644,637
4,801,986
4,883,767
4,430,792
4,605,948
4,682,195
4,803,533
4,888,627
4,443,931
4,618,872
4,684,413
4,809,045
4,890,143
4,466,176
4,620,211
4,694,313
4,809,047
4,901,127
4,516,143
4,631,564
4,717,679
4,810,665
4,904,609
4,532,534
4,639,754
4,743,952
4,823,176
4,933,740
4,567,641
4,639,762
4,783,690
4,837,606
4,963,951
4,587,713
4,641,162
4,794,432
4,860,080
4,969,027
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.
File Number 4041
Copyright © Harris Corporation 1995
1