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HGTG30N60C3D

更新时间: 2024-11-07 04:21:43
品牌 Logo 应用领域
哈里斯 - HARRIS 晶体二极管晶体管电动机控制瞄准线双极性晶体管局域网
页数 文件大小 规格书
8页 131K
描述
63A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode

HGTG30N60C3D 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:unknown
风险等级:5.63Is Samacsys:N
其他特性:LOW CONDUCTION LOSS, HYPER FAST RECOVERY最大集电极电流 (IC):63 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
最大降落时间(tf):275000000000 ns门极发射器阈值电压最大值:6 V
门极-发射极最大电压:20 VJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):208 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:MOTOR CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):320 ns标称接通时间 (ton):40 ns
Base Number Matches:1

HGTG30N60C3D 数据手册

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S E M I C O N D U C T O R  
HGTG30N60C3D  
63A, 600V, UFS Series N-Channel IGBT  
with Anti-Parallel Hyperfast Diode  
August 1995  
Features  
Package  
• 63A, 600V at TC = +25oC  
JEDEC STYLE TO-247  
• Typical Fall Time - 230ns at TJ = +150oC  
E
C
• Short Circuit Rating  
G
• Low Conduction Loss  
• Hyperfast Anti-Parallel Diode  
Description  
The HGTG30N60C3D is a MOS gated high voltage switching  
device combining the best features of MOSFETs and bipolar  
transistors. The device has the high input impedance of a MOS-  
FET and the low on-state conduction loss of a bipolar transistor.  
The much lower on-state voltage drop varies only moderately  
between +25oC and +150oC. The IGBT used is the development  
type TA49051. The diode used in anti-parallel with the IGBT is  
the development type TA49053.  
Terminal Diagram  
N-CHANNEL ENHANCEMENT MODE  
C
The IGBT is ideal for many high voltage switching applications  
operating at moderate frequencies where low conduction  
losses are essential.  
G
PACKAGING AVAILABILITY  
PART NUMBER  
PACKAGE  
TO-247  
BRAND  
G30N60C3D  
E
HGTG30N60C3D  
NOTE: When ordering, use the entire part number.  
Formerly Developmental Type TA49014.  
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified  
C
HGTG30N60C3D  
UNITS  
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV  
600  
V
CES  
Collector Current Continuous  
o
At T = +25 C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
63  
30  
25  
252  
±20  
A
A
A
A
V
V
C
C25  
C110  
o
At T = +110 C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Average Diode Forward Current at +110 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
Switching Safe Operating Area at T = +150 C . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA  
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . .T , T  
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
Short Circuit Withstand Time (Note 2) at V = 15V . . . . . . . . . . . . . . . . . . . . . . . . . . t  
Short Circuit Withstand Time (Note 2) at V = 10V . . . . . . . . . . . . . . . . . . . . . . . . . . t  
C
o
(AVG)  
CM  
GES  
GEM  
±30  
o
60A at 600V  
208  
1.67  
-40 to +150  
260  
J
o
W
C
D
o
o
W/ C  
C
o
C
C
J
STG  
o
L
SC  
SC  
4
15  
µs  
µs  
GE  
GE  
NOTE:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature.  
o
2. V  
= 360V, T = +125 C, R = 25Ω.  
CE(PK)  
J
GE  
HARRIS SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:  
4,364,073  
4,417,385  
4,598,461  
4,644,637  
4,801,986  
4,883,767  
4,430,792  
4,605,948  
4,682,195  
4,803,533  
4,888,627  
4,443,931  
4,618,872  
4,684,413  
4,809,045  
4,890,143  
4,466,176  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,516,143  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,532,534  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,567,641  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
4,587,713  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.  
File Number 4041  
Copyright © Harris Corporation 1995  
1

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