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FQB34N20LTM PDF预览

FQB34N20LTM

更新时间: 2024-11-25 11:14:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
10页 954K
描述
功率 MOSFET,N 沟道,逻辑电平,QFET®,200 V,31 A,80 mΩ,D2PAK

FQB34N20LTM 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:1 week风险等级:0.74
雪崩能效等级(Eas):640 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (ID):31 A最大漏源导通电阻:0.08 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):67 pF
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL功耗环境最大值:3.13 W
最大功率耗散 (Abs):180 W最大脉冲漏极电流 (IDM):124 A
认证状态:Not Qualified表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):1100 ns
最大开启时间(吨):1150 nsBase Number Matches:1

FQB34N20LTM 数据手册

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FQB34N20LTM 替代型号

型号 品牌 替代类型 描述 数据表
PSMN070-200B,118 NXP

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