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AUIRF1324STRL PDF预览

AUIRF1324STRL

更新时间: 2024-11-09 06:38:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
13页 473K
描述
HEXFETPower MOSFET

AUIRF1324STRL 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANT, D2PAK-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:16 weeks
风险等级:5.07Is Samacsys:N
其他特性:ULTRA-LOW RESISTANCE雪崩能效等级(Eas):270 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:24 V
最大漏极电流 (Abs) (ID):195 A最大漏极电流 (ID):195 A
最大漏源导通电阻:0.00165 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):300 W
最大脉冲漏极电流 (IDM):1420 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRF1324STRL 数据手册

 浏览型号AUIRF1324STRL的Datasheet PDF文件第2页浏览型号AUIRF1324STRL的Datasheet PDF文件第3页浏览型号AUIRF1324STRL的Datasheet PDF文件第4页浏览型号AUIRF1324STRL的Datasheet PDF文件第5页浏览型号AUIRF1324STRL的Datasheet PDF文件第6页浏览型号AUIRF1324STRL的Datasheet PDF文件第7页 
PD - 97483  
AUIRF1324S  
AUTOMOTIVE GRADE  
AUIRF1324L  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
D
S
VDSS  
24V  
Ultra Low On-Resistance  
Dynamic dV/dT Rating  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
RDS(on) typ.  
1.3m  
G
ID  
340A  
(Silicon Limited)  
ID  
195A  
(Package Limited)  
Description  
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to achieve  
extremely low on-resistance per silicon area. Additional features of  
this design are a 175°C junction operating temperature, fast switch-  
ing speed and improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and reliable  
device for use in Automotive applications and a wide variety of other  
S
S
D
G
D
G
D2Pak  
AUIRF1324S  
TO-262  
AUIRF1324L  
applications.  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
Max.  
340  
Units  
240  
A
195  
1420  
PD @TC = 25°C  
300  
Maximum Power Dissipation  
W
W/°C  
V
2.0  
Linear Derating Factor  
VGS  
EAS  
IAR  
± 20  
270  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
See Fig. 14, 15, 22a, 22b  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
mJ  
V/ns  
0.46  
Peak Diode Recovery  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
°C  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.50  
40  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθJA  
Junction-to-Ambient (PCB Mounted, steady-state)  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
03/29/2010  

AUIRF1324STRL 替代型号

型号 品牌 替代类型 描述 数据表
IRF1324SPBF INFINEON

完全替代

HEXFET Power MOSFET
AUIRF1324S INFINEON

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HEXFETPower MOSFET

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