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AUIRF1404STRL

更新时间: 2024-01-17 15:42:23
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AUIRF1404STRL 数据手册

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PD - 97460  
AUIRF1404Z  
AUIRF1404ZS  
AUTOMOTIVE GRADE  
AUIRF1404ZL  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
LowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
D
V(BR)DSS  
40V  
RDS(on) max.  
3.7m  
180A  
G
ID (Silicon Limited)  
ID (Package Limited)  
Automotive Qualified *  
S
160A  
Description  
D
D
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea. Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitiveavalancherating. Thesefeaturescom-  
bine to make this design an extremely efficient  
andreliabledeviceforuseinAutomotiveapplica-  
tions and a wide variety of other applications.  
D
S
S
D
D
S
D
G
G
G
D2Pak  
TO-262  
AUIRF1404ZL  
TO-220AB  
AUIRF1404Z  
AUIRF1404ZS  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
Units  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
180  
ID @ TC = 100°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
120  
160  
710  
A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
IDM  
PD @TC = 25°C  
Power Dissipation  
200  
1.3  
± 20  
W
W/°C  
V
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
VGS  
EAS  
330  
480  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
Operating Junction and  
-55 to + 175  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
300  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.75  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
RθJA  
0.50  
–––  
–––  
62  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
–––  
40  
Junction-to-Ambient (PCB Mount)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
02/19/2010  

AUIRF1404STRL 替代型号

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