PD-96290A
AUIRF2804
AUIRF2804S
AUTOMOTIVE GRADE
AUIRF2804L
Features
HEXFET® Power MOSFET
l
l
l
l
l
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Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
V(BR)DSS
40V
D
RDS(on) typ.
1.5m
Ω
Ω
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
max. 2.0m
G
ID (Silicon Limited) 270A
ID (Package Limited) 195A
S
Description
Specifically designed for Automotive applications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of this
design are a 175°C junction operating temperature,
fast switching speed and improved repetitive ava-
lanche rating . These features combine to make this
design an extremely efficient and reliable device for
use in Automotive applications and a wide variety of
other applications.
D
D
D
S
D
S
S
D
G
D
G
G
D2Pak
TO-262
TO-220AB
AUIRF2804
AUIRF2804S
AUIRF2804L
G
D
S
Gate
Drain
Source
AbsoluteMaximumRatings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the
specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Max.
270
Units
I
I
I
I
@ TC = 25°C
@ TC = 100°C
@ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
D
D
D
190
A
195
(P ackage Limited)
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
1080
300
DM
P
D
@TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
Gate-to-Source Voltage
2.0
± 20
W/°C
V
V
GS
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS
540
1160
mJ
EAS (tested)
IAR
See Fig.12a,12b,15,16
A
Repetitive Avalanche Energy
EAR
mJ
T
T
Operating Junction and
-55 to + 175
J
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
Typ.
–––
0.50
–––
–––
Max.
0.50
–––
62
Units
Junction-to-Case
Rθ
Rθ
Rθ
Rθ
JC
CS
JA
JA
Case-to-Sink, Flat, Greased Surface
°C/W
Junction-to-Ambient
Junction-to-Ambient (PCB Mount, steady state)
40
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
03/13/12