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STD30N6LF6AG PDF预览

STD30N6LF6AG

更新时间: 2024-11-28 14:57:51
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
15页 434K
描述
汽车级N沟道60 V、19 mOhm典型值、24 A STripFET F6功率MOSFET,DPAK封装

STD30N6LF6AG 技术参数

生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:22 weeks风险等级:1.51
雪崩能效等级(Eas):130 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):24 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):40 W
最大脉冲漏极电流 (IDM):96 A参考标准:AEC-Q101
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

STD30N6LF6AG 数据手册

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STD30N6LF6AG  
Automotive-grade N-channel 60 V, 19 mΩ typ., 24 A  
STripFET™ F6 Power MOSFET in a DPAK package  
Datasheet - production data  
Features  
Order code  
VDS RDS(on) max.  
25 mΩ  
ID  
PTOT  
STD30N6LF6AG 60 V  
24 A 40 W  
Designed for automotive applications and  
AEC-Q101 qualified  
Very low on-resistance  
Very low gate charge  
High avalanche ruggedness  
Low gate drive power loss  
Figure 1: Internal schematic diagram  
Applications  
D(2, TAB)  
Switching applications  
Description  
This device is an N-channel Power MOSFET  
developed using the STripFET™ F6 technology  
with a new trench gate structure. The resulting  
Power MOSFET exhibits very low RDS(on) in all  
packages.  
G(1)  
S(3)  
AM01475v1_Tab  
Table 1: Device summary  
Order code  
Marking  
Package  
DPAK  
Packing  
STD30N6LF6AG  
30N6LF6  
Tape and Reel  
June 2015  
DocID028036 Rev 1  
1/15  
www.st.com  
This is information on a product in full production.  

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