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SSM3J36TU

更新时间: 2024-11-05 12:22:59
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
5页 186K
描述
Power Management Switches

SSM3J36TU 数据手册

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SSM3J36TU  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM3J36TU  
Power Management Switches  
1.5-V drive  
Unit: mm  
Low ON-resistance: R = 3.60 Ω (max) (@V  
= -1.5 V)  
= -1.8 V)  
= -2.8 V)  
= -4.5 V)  
on  
GS  
: R = 2.70 Ω (max) (@V  
on  
GS  
GS  
GS  
2.1±0.1  
1.7±0.1  
: R = 1.60 Ω (max) (@V  
on  
: R = 1.31 Ω (max) (@V  
on  
Absolute Maximum Ratings (Ta = 25 °C)  
1
2
3
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
-20  
±8  
V
V
DSS  
Gate-source voltage  
GSS  
DC  
I
-330  
D
Drain current  
mA  
Pulse  
I
-660  
DP  
P
P
(Note1)  
(Note2)  
500  
D
Drain power dissipation  
mW  
800  
D
Channel temperature  
T
150  
°C  
°C  
ch  
1: Gate  
UFM  
T
stg  
55 to 150  
Storage temperature range  
2: Source  
3: Drain  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
2-2U1A  
Weight: 6.6 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and  
estimated failure rate, etc).  
Note1: Mounted on an FR4 board  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)  
Note2: Mounted on a ceramic board.  
(25.4 mm × 25.4 mm × 0.8 mm, Cu Pad: 645 mm2 )  
Marking  
Equivalent Circuit (top view)  
3
3
P X  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment is  
protected against static electricity. Operators should wear anti-static clothing, and containers and other objects that come  
into direct contact with devices should be made of anti-static materials.  
Usage Considerations  
Let V be the voltage applied between gate and source that causes the drain current (I ) to below 1 mA for the  
th  
D
SSM3J36TU). Then, for normal switching operation, V  
must be higher than V and V  
must be lower than  
GS(off)  
GS(on)  
th,  
V
th.  
This relationship can be expressed as: V  
< V < V Take this into consideration when using the device.  
th GS(on).  
GS(off)  
1
2008-06-11  

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