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SSM3K01T PDF预览

SSM3K01T

更新时间: 2024-11-17 22:14:19
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
5页 157K
描述
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type

SSM3K01T 技术参数

生命周期:End Of Life包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.28
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):3.2 A
最大漏极电流 (ID):3.2 A最大漏源导通电阻:0.12 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.25 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSM3K01T 数据手册

 浏览型号SSM3K01T的Datasheet PDF文件第2页浏览型号SSM3K01T的Datasheet PDF文件第3页浏览型号SSM3K01T的Datasheet PDF文件第4页浏览型号SSM3K01T的Datasheet PDF文件第5页 
                                                        
                                                        
SSM3K01T  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM3K01T  
High Speed Switching Applications  
Unit: mm  
·
·
Small Package  
Low on Resistance: R = 120 m(max) (@V  
= 4 V)  
on  
GS  
GS  
: R = 150 m(max) (@V  
= 2.5 V)  
on  
·
Low Gate Threshold Voltage: V = 0.6~1.1 V  
th  
(@V  
DS  
= 3 V, I = 0.1 mA)  
D
Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Drain-Source voltage  
Gate-Source voltage  
DC  
V
30  
±10  
3.2  
V
V
DS  
V
GSS  
I
D
Drain current  
A
I
DP  
(Note2)  
Pulse  
6.4  
P
D
Drain power dissipation (Ta = 25°C)  
1250  
mW  
(Note1)  
Channel temperature  
Storage temperature range  
T
150  
-55~150  
°C  
°C  
ch  
JEDEC  
JEITA  
T
stg  
Note1: Mounted on FR4 board  
2
TOSHIBA  
2-3S1A  
(25.4 mm ´ 25.4 mm ´ 1.6 t, Cu pad: 645 mm , t = 10 s)  
Weight: 10 mg (typ.)  
Note2: The pulse width limited by max channel temperature.  
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the  
environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and  
containers and other objects that come into direct contact with devices should be made of anti-static materials.  
The Channel-to-Ambient thermal resistance R  
and the drain power dissipation P vary according to  
D
th (ch-a)  
the board material, board area, board thickness and pad area, and are also affected by the environment in  
which the product is used. When using this device, please take heat dissipation fully into account.  
1
2002-01-24  

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