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SSM3K02T(TE85L) PDF预览

SSM3K02T(TE85L)

更新时间: 2024-11-16 14:36:55
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 218K
描述
SSM3K02T(TE85L)

SSM3K02T(TE85L) 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

SSM3K02T(TE85L) 数据手册

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SSM3K02T  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM3K02T  
High Speed Switching Applications  
Unit: mm  
Small package  
Low on resistance: R = 200 m(max) (V  
= 4 V)  
on  
GS  
GS  
: R = 250 m(max) (V  
= 2.5 V)  
on  
Low gate threshold voltage: V = 0.6~1.1 V (V  
= 3 V, I = 0.1 mA)  
DS D  
th  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
30  
±10  
2.5  
5.0  
V
V
DS  
Gate-source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
DP  
P
D
Drain power dissipation (Ta = 25°C)  
1250  
mW  
(Note 1)  
JEDEC  
JEITA  
Channel temperature  
T
150  
°C  
°C  
ch  
Storage temperature range  
T
stg  
55~150  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
TOSHIBA  
2-3S1A  
Weight: 0.01 g (typ.)  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm , t = 10 s)  
Note 2: The pulse width limited by max channel temperature.  
Marking  
Equivalent Circuit  
3
3
K U  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment  
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  

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