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SSM3K106TU PDF预览

SSM3K106TU

更新时间: 2024-11-16 04:02:43
品牌 Logo 应用领域
东芝 - TOSHIBA 开关
页数 文件大小 规格书
6页 138K
描述
Silicon N Channel MOS Type High-Speed Switching Applications

SSM3K106TU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:End Of Life包装说明:SMALL OUTLINE, R-PDSO-F3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.32
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):1.2 A最大漏极电流 (ID):1.2 A
最大漏源导通电阻:0.53 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):0.8 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SSM3K106TU 数据手册

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SSM3K106TU  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM3K106TU  
High-Speed Switching Applications  
Unit: mm  
4 V drive  
2.1±0.1  
1.7±0.1  
Low ON-resistance:  
R
R
= 530 m(max) (@V  
= 310 m(max) (@V  
= 4 V)  
on  
GS  
GS  
= 10 V)  
on  
Absolute Maximum Ratings (Ta = 25°C)  
1
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
3
2
V
20  
± 20  
1.2  
V
V
DS  
Gate-source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
2.4  
DP  
P
P
800  
D (Note 1)  
D (Note 2)  
Drain power dissipation  
Channel temperature  
mW  
500  
1: Gate  
2: Source  
3: Drain  
T
150  
°C  
°C  
ch  
Storage temperature range  
T
55~150  
stg  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
UFM  
JEDEC  
JEITA  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
TOSHIBA  
2-2U1A  
Weight: 6.6 mg (typ.)  
Note 1: Mounted on a ceramic board.  
(25.4 mm × 25.4 mm × 0.8 mm, Cu Pad: 645 mm2 )  
Note 2: Mounted on an FR4 board.  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2 )  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Drain-source breakdown voltage  
Drain cutoff current  
Symbol  
Test Conditions  
Min  
20  
Typ.  
Max  
Unit  
V
V
I
= 1 mA, V  
= 0  
(BR) DSS  
D
GS  
I
V
V
V
V
= 20 V, V  
= 0  
1
μA  
μA  
V
DSS  
GSS  
DS  
GS  
DS  
DS  
GS  
= ±20 V, V  
Gate leakage current  
I
= 0  
±1  
2.3  
DS  
Gate threshold voltage  
Forward transfer admittance  
V
= 5 V, I = 0.1 mA  
1.1  
0.58  
th  
D
Y ⏐  
= 5 V, I = 0.6 A  
(Note 3)  
1.16  
S
fs  
D
I
I
= 0.6 A, V  
= 10 V  
= 4 V  
(Note 3)  
(Note 3)  
230  
390  
36  
310  
530  
D
D
GS  
GS  
Drain-source ON-resistance  
R
mΩ  
DS (ON)  
= 0.6 A, V  
Input capacitance  
C
V
V
V
= 10 V, V  
= 10 V, V  
= 10 V, V  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
pF  
pF  
iss  
DS  
DS  
DS  
GS  
GS  
GS  
Output capacitance  
C
30  
10  
oss  
pF  
ns  
V
Reverse transfer capacitance  
C
rss  
on  
Turn-on time  
Switching time  
t
t
21  
V
V
= 10 V, I = 0.6 A,  
D
DD  
GS  
= 0~4 V, R = 10 Ω  
G
Turn-off time  
8
off  
Drain-source forward voltage  
Note 3: Pulse test  
V
I
= −1.2 A, V = 0 V  
GS  
(Note 3)  
1.0  
1.4  
DSF  
D
1
2007-11-01  

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