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SSM3K122TU PDF预览

SSM3K122TU

更新时间: 2024-11-10 04:02:43
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体开关小信号场效应晶体管光电二极管
页数 文件大小 规格书
6页 141K
描述
Power Management Switch Applications

SSM3K122TU 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.33
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):2 A
最大漏极电流 (ID):1.8 A最大漏源导通电阻:0.44 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.8 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSM3K122TU 数据手册

 浏览型号SSM3K122TU的Datasheet PDF文件第2页浏览型号SSM3K122TU的Datasheet PDF文件第3页浏览型号SSM3K122TU的Datasheet PDF文件第4页浏览型号SSM3K122TU的Datasheet PDF文件第5页浏览型号SSM3K122TU的Datasheet PDF文件第6页 
SSM3K122TU  
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type  
SSM3K122TU  
Power Management Switch Applications  
High-Speed Switching Applications  
1.5 V drive  
Unit: mm  
2.1±0.1  
Low ON-resistance:  
R
on  
R
on  
R
on  
R
on  
= 304 m(max) (@V  
= 1.5 V)  
= 1.8 V)  
= 2.5 V)  
= 4.0 V)  
GS  
= 211 m(max) (@V  
GS  
1.7±0.1  
= 161 m(max) (@V  
= 123 m(max) (@V  
GS  
GS  
1
2
Absolute Maximum Ratings (Ta = 25°C)  
3
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
V
20  
± 10  
2.0  
V
V
DSS  
Gate-Source voltage  
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
4.0  
DP  
P
P
800  
D (Note 1)  
D (Note 2)  
Drain power dissipation  
Channel temperature  
mW  
500  
T
150  
°C  
°C  
ch  
Storage temperature range  
T
55~150  
stg  
1: Gate  
2: Source  
3: Drain  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
UFM  
JEDEC  
JEITA  
TOSHIBA  
2-2U1A  
Weight: 6.6 mg (typ.)  
Note 1: Mounted on a ceramic board.  
(25.4 mm × 25.4 mm × 0.8 t, Cu Pad: 645 mm2 )  
Note 2: Mounted on a FR4 board.  
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm2 )  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
I
I
= 1 mA, V  
= 1 mA, V  
= 0 V  
20  
12  
1
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-Source breakdown voltage  
V
V
= − 10 V  
= 0 V  
Drain cutoff current  
I
V
V
V
V
= 20 V, V  
μA  
μA  
V
DSS  
GSS  
DS  
GS  
DS  
DS  
GS  
= ± 10 V, V  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= 0 V  
±1  
1.0  
123  
161  
211  
304  
DS  
= 3 V, I = 1 mA  
V
0.35  
2.6  
th  
Y ⏐  
D
= 3 V, I = 1.0 A  
(Note 3)  
(Note 3)  
(Note 3)  
(Note 3)  
(Note 3)  
5.2  
87  
S
fs  
D
I
I
I
I
= 1.0 A, V  
= 1.0 A, V  
= 0.5 A, V  
= 0.3 A, V  
= 4.0 V  
= 2.5 V  
= 1.8 V  
= 1.5 V  
D
D
D
D
GS  
GS  
GS  
GS  
112  
147  
182  
195  
35  
Drain-Source ON-resistance  
R
mΩ  
DS (ON)  
Input capacitance  
C
C
iss  
V
= 10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
nC  
Output capacitance  
Reverse transfer capacitance  
Total Gate Charge  
DS  
oss  
C
rss  
Qg  
29  
3.4  
2.3  
1.1  
8.0  
9.0  
0.85  
V
V
= 10 V, I = 2.0 A  
D
= 4 V  
DS  
GS  
GateSource Charge  
GateDrain Charge  
Qgs  
Qgd  
Turn-on time  
Switching time  
t
t
V
V
= 10 V, I = 0.5 A,  
= 0 to 2.5 V, R = 4.7 Ω  
on  
off  
DD  
GS  
D
ns  
V
Turn-off time  
G
Drain-Source forward voltage  
Note 3: Pulse test  
V
I
= −2.0 A, V = 0 V  
GS  
(Note 3)  
-1.2  
DSF  
D
1
2007-11-01  

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