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SSM3K116TU PDF预览

SSM3K116TU

更新时间: 2024-09-29 04:02:43
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体开关小信号场效应晶体管光电二极管PC
页数 文件大小 规格书
5页 142K
描述
Silicon N Channel MOS Type High Speed Switching Applications

SSM3K116TU 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-F3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.32
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:613590Samacsys Pin Count:3
Samacsys Part Category:Integrated CircuitSamacsys Package Category:SO Transistor Flat Lead
Samacsys Footprint Name:SSM3K116TU+--Samacsys Released Date:2020-04-04 16:16:00
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):2.2 A
最大漏极电流 (ID):2.2 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.8 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSM3K116TU 数据手册

 浏览型号SSM3K116TU的Datasheet PDF文件第2页浏览型号SSM3K116TU的Datasheet PDF文件第3页浏览型号SSM3K116TU的Datasheet PDF文件第4页浏览型号SSM3K116TU的Datasheet PDF文件第5页 
SSM3K116TU  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type  
SSM3K116TU  
High Speed Switching Applications  
2.5V drive  
Unit: mm  
Low on-resistance:  
R
R
= 135m(max) (@V  
= 100m(max) (@V  
= 2.5 V)  
= 4.5 V)  
on  
GS  
GS  
2.1±0.1  
1.7±0.1  
on  
Absolute Maximum Ratings (Ta = 25°C)  
1
Characteristic  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
30  
± 12  
2.2  
V
V
3
DS  
2
Gate-Source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
4.4  
DP  
P
P
800  
D (Note 1)  
D (Note 2)  
Drain power dissipation  
Channel temperature  
mW  
500  
T
150  
°C  
°C  
ch  
Storage temperature range  
T
55~150  
stg  
1: Gate  
2: Source  
3: Drain  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
UFM  
JEDEC  
JEITA  
TOSHIBA  
2-2U1A  
Weight: 6.6 mg (typ.)  
Note 1: Mounted on ceramic board.  
(25.4 mm × 25.4 mm × 0.8 mm, Cu Pad: 645 mm2 )  
Note 2: Mounted on FR4 board.  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2 )  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Conditions  
Min  
Typ.  
Max  
Unit  
V
V
V
I
I
= 1 mA, V  
= 1 mA, V  
= 0  
30  
18  
1
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-Source breakdown voltage  
= −12 V  
Drain cut-off current  
I
V
V
V
V
= 30 V, V = 0  
GS  
μA  
μA  
V
DSS  
GSS  
DS  
GS  
DS  
DS  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= ±12V, V = 0  
0.5  
1
2
±1  
1.1  
DS  
V
= 3 V, I = 0.1 mA  
th  
D
Y ⏐  
= 3 V, I = 0.25 A  
(Note3)  
S
fs  
D
I
I
= 0.5 A, V  
= 4.5 V  
(Note3)  
(Note3)  
75  
95  
100  
135  
D
D
GS  
Drain-Source on-resistance  
R
mΩ  
DS (ON)  
= 0.25 A, V  
= 2.5 V  
GS  
Input capacitance  
C
V
V
V
= 10 V, V  
= 10 V, V  
= 10 V, V  
= 0, f = 1 MHz  
245  
pF  
pF  
iss  
DS  
DS  
DS  
GS  
GS  
GS  
Output capacitance  
C
= 0, f = 1 MHz  
= 0, f = 1 MHz  
41  
33  
oss  
pF  
ns  
V
Reverse transfer capacitance  
C
rss  
on  
Turn-on time  
Switching time  
t
t
9
V
V
= 10 V, I = 0.25 A,  
D
DD  
GS  
= 0~2.5 V, R = 4.7 Ω  
G
Turn-off time  
15  
off  
Drain-Source forward voltage  
Note3: Pulse test  
V
I
= −2.2A, V = 0 V  
GS  
(Note3)  
0.83  
-1.2  
DSF  
D
1
2007-11-01  

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