Datasheet > SiSS32DN

SiSS32DN

更新时间： 2024-11-06 14:55:27

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	251K
描述
N-Channel 80 V (D-S) MOSFET

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SiSS32DN 数据手册

SiSS32DN

Vishay Siliconix

www.vishay.com

N-Channel 80 V (D-S) MOSFET

FEATURES

PowerPAK^®1212-8S

• TrenchFET^®Gen IV power MOSFET

• Very low R_DS- Q_gfigure-of-merit (FOM)

• Tuned for the lowest R_DS- Q_ossFOM

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• Primary side switch

• DC/DC converter

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= 10 V

0.0072

0.0087

31.5

• Solar micro inverter

_DS(on)max. () at V_GS= 7.5 V

• Motor drive switch

Q_gtyp. (nC)

I_D(A)

Configuration

• Battery and load switch

• Industrial

N-Channel MOSFET

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8S

SiSS32DN-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

50.3

17.4 ^{b, c}

13.9 ^{b, c}

150

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

59.7

4.5 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

65.7

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

5 ^{b, c}

3.2 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

1.9

°C/W

Maximum junction-to-case (drain)

1.5

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 63 °C/W

g. T_C= 25 °C

S18-0804-Rev. A, 13-Aug-2018

Document Number: 77833

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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