Datasheet > SiSS52DN

SiSS52DN

更新时间： 2023-12-06 20:07:47

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	301K
描述
N-Channel 30 V (D-S) MOSFET

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SiSS52DN 数据手册

SiSS52DN

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen V power MOSFET

PowerPAK^®1212-8S

• Very low R_DSx Q_gfigure-of-merit (FOM)

• Enables higher power density with very low

R_DS(on)and thermally enhanced compact

package

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Top View

Bottom View

APPLICATIONS

PRODUCT SUMMARY

V_DS(V)

R_DS(on)max. () at V_GS= 10 V

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

• DC/DC converterä

• POL

0.0012

0.0019

19.9

• Synchronous rectification

• Battery management

• Power and load switch

I_D(A)

162

Configuration

Single

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK 1212-8S

SiSS52DN-T1-GE3

SiSS52DN-T1-UE3

Lead (Pb)-free, halogen-free, BLR and IOL

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

+16 / -12

162

UNIT

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

T_A= 25 °C

T_A= 70 °C

129

Continuous drain current (T_J= 150 °C)

I_D

47.1 ^{b, c}

37.7 ^{b, c}

250

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

51.8

4.3 ^{b, c}

4.8 ^{b, c}

3 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^b

t  10 s

Steady state

2.2

°C/W

Maximum junction-to-case (drain)

1.7

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

g. T_C= 25 °C

S23-0122-Rev. C, 06-Mar-2023

Document Number: 79977

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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